Proceedings Electronic Components and Technology Conference
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Publication Venue For
- Stretchable microfluidic electric circuit applied for radio frequency antenna. 1582-1587. 2011
- Vertically coupled polymer microdisk resonators fabricated by photolithography technique. 2035-2040. 2007
- Low temperature co-fired ceramics for micro-fluidics. 2006:699-704. 2006
- Comparative high speed optical interconnections using thin film photodetectors embedded in polymer waveguides. 2:1611-1616. 2005
- Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate. 2:1835-1841. 2005
- Embedded optical interconnections on printed wiring boards. 2:1524-1529. 2004
- FR4 printed circuit board design for Giga-bits embedded optical interconnect applications. 2:1996-2001. 2004
- Heterogeneous integration of InP/InGaAsP MQW thin film edge emitting lasers and polymer waveguides. 2:1537-1541. 2004
- Physical design of optoelectronic system-on-a-package using optical waveguide interconnects. 1:29-34. 2004
- Comparison of electrical and optical interconnect. 1067-1072. 2003
- Embedded optical interconnections on printed wiring boards. 1153-1159. 2003
- High speed optical interconnection using embedded PDs on electrical boards. 1046-1052. 2003
- Test-structure free modeling method for de-embedding the effects of pads on device modeling. 1694-1700. 2003
- Highly alignment tolerant InGaAs inverted MSM photodetector heterogeneously integrated on a differential Si CMOS receiver operating at 1 Gbps. 8-13. 2001
- Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates. 223-230. 2000
- Statistical analysis of embedded capacitors using Monte Carlo simulation. 198-205. 2000
- Coupling efficiency of an alignment-tolerant, single fiber, bi-directional link. 30-36. 1997
- Optical MCM interconnect using hybrid integration of GaAs optoelectronics with a glass signal routing layer. 770-776. 1995
- MONOCRYSTALLINE beta -SIC SEMICONDUCTOR THIN FILMS: EPITAXIAL GROWTH, DOPING, AND FET DEVICE DEVELOPMENT.. 342-349. 1988
- Shape memory capacitors for next generation embedded actives 2006