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A metallization and bonding approach for high performance carbon nanotube thermal interface materials.

Publication ,  Journal Article
Cross, R; Cola, BA; Fisher, T; Xu, X; Gall, K; Graham, S
Published in: Nanotechnology
November 2010

A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 °C. By reducing the adhesion of the VACNTs to the growth substrate during synthesis, the CNTs can be completely transferred from the Si growth substrate and used as a die attachment material for electronic components. Thermal resistance measurements using a photoacoustic technique showed thermal resistances as low as 1.7 mm(2) K W(-1) for bonded VACNT films 25-30 µm in length and 10 mm(2) K W(-1) for CNTs up to 130 µm in length. Tensile testing demonstrated a die attachment strength of 40 N cm(-2) at room temperature. Overall, these metallized and bonded VACNT films demonstrate properties which are promising for next-generation thermal interface material applications.

Duke Scholars

Published In

Nanotechnology

DOI

EISSN

1361-6528

ISSN

0957-4484

Publication Date

November 2010

Volume

21

Issue

44

Start / End Page

445705

Related Subject Headings

  • Nanoscience & Nanotechnology
 

Citation

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MLA
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Cross, R., Cola, B. A., Fisher, T., Xu, X., Gall, K., & Graham, S. (2010). A metallization and bonding approach for high performance carbon nanotube thermal interface materials. Nanotechnology, 21(44), 445705. https://doi.org/10.1088/0957-4484/21/44/445705
Cross, Robert, Baratunde A. Cola, Timothy Fisher, Xianfan Xu, Ken Gall, and Samuel Graham. “A metallization and bonding approach for high performance carbon nanotube thermal interface materials.Nanotechnology 21, no. 44 (November 2010): 445705. https://doi.org/10.1088/0957-4484/21/44/445705.
Cross R, Cola BA, Fisher T, Xu X, Gall K, Graham S. A metallization and bonding approach for high performance carbon nanotube thermal interface materials. Nanotechnology. 2010 Nov;21(44):445705.
Cross, Robert, et al. “A metallization and bonding approach for high performance carbon nanotube thermal interface materials.Nanotechnology, vol. 21, no. 44, Nov. 2010, p. 445705. Epmc, doi:10.1088/0957-4484/21/44/445705.
Cross R, Cola BA, Fisher T, Xu X, Gall K, Graham S. A metallization and bonding approach for high performance carbon nanotube thermal interface materials. Nanotechnology. 2010 Nov;21(44):445705.
Journal cover image

Published In

Nanotechnology

DOI

EISSN

1361-6528

ISSN

0957-4484

Publication Date

November 2010

Volume

21

Issue

44

Start / End Page

445705

Related Subject Headings

  • Nanoscience & Nanotechnology