Thermomechanical behavior and reliability of Au/Si MEMS structures

Published

Conference Paper

© 2004 IEEE. Our work with micromechanical structures investigates the magnitude and physics of inelastic behavior at various thermomechanical-loading conditions. We also seek to achieve greater mechanical stability, for example using nanometer-thick atomic-layer deposition (ALD) coatings.

Full Text

Duke Authors

Cited Authors

  • Miller, D; Herrmann, C; Spark, K; Finch, D; George, S; Stoldt, C; Gall, K

Published Date

  • January 1, 2004

Published In

Volume / Issue

  • 2004-January / January

Start / End Page

  • 633 - 634

International Standard Serial Number (ISSN)

  • 1541-7026

Digital Object Identifier (DOI)

  • 10.1109/RELPHY.2004.1315425

Citation Source

  • Scopus