Thermomechanical behavior and reliability of AU/SI MEMS structures

Published

Conference Paper

The magnitude and physics of inelastic behavior of Au/Si microelectromechanical structures at various thermomechanical loading conditions were investigated. Bimorph gold and polysilicon cantilever beams were fabricated by commercial foundry process. The curvature of beam was measured to characterize the structure's shape. Increased separation of grain boundaries was shown with the help of field emission scanning electron microscopy. It was suggested that grain boundary separation, surface evolution and hillocking can have adverse effects on optical, RF and DC electronics applications.

Duke Authors

Cited Authors

  • Miller, D; Herrmann, C; Spark, K; Finch, D; George, S; Stoldt, C; Gall, K

Published Date

  • July 12, 2004

Published In

Start / End Page

  • 633 - 634

International Standard Serial Number (ISSN)

  • 0099-9512

Citation Source

  • Scopus