Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits

Journal Article

Full Text

Duke Authors

Cited Authors

  • Koneru, A; Kannan, S; Chakrabarty, K

Published Date

  • July 11, 2017

Published In

Volume / Issue

  • 13 / 4

Start / End Page

  • 1 - 23

International Standard Serial Number (ISSN)

  • 1550-4832

Digital Object Identifier (DOI)

  • 10.1145/3041026