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<title>Temperature-induced deformation in shape memory alloys</title>

Publication ,  Conference
Brinson, LC; Bekker, AM; Hwang, S
Published in: Active Materials and Smart Structures
February 2, 1995

Duke Scholars

Published In

Active Materials and Smart Structures

DOI

ISSN

0277-786X

Publication Date

February 2, 1995

Publisher

SPIE

Conference Name

Symposium on Active Materials and Smart Structures: Society of Engineering Science 31st Annual Meeting

Related Subject Headings

  • 5102 Atomic, molecular and optical physics
  • 4009 Electronics, sensors and digital hardware
  • 4006 Communications engineering
 

Citation

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Brinson, L. C., Bekker, A. M., & Hwang, S. (1995). <title>Temperature-induced deformation in shape memory alloys</title>. In G. L. Anderson & D. C. Lagoudas (Eds.), Active Materials and Smart Structures. SPIE. https://doi.org/10.1117/12.200920
Brinson, L Catherine, Alexander M. Bekker, and S. Hwang. “<title>Temperature-induced deformation in shape memory alloys</title>.” In Active Materials and Smart Structures, edited by Gary L. Anderson and Dimitris C. Lagoudas. SPIE, 1995. https://doi.org/10.1117/12.200920.
Brinson LC, Bekker AM, Hwang S. <title>Temperature-induced deformation in shape memory alloys</title>. In: Anderson GL, Lagoudas DC, editors. Active Materials and Smart Structures. SPIE; 1995.
Brinson, L. Catherine, et al. “<title>Temperature-induced deformation in shape memory alloys</title>.” Active Materials and Smart Structures, edited by Gary L. Anderson and Dimitris C. Lagoudas, SPIE, 1995. Crossref, doi:10.1117/12.200920.
Brinson LC, Bekker AM, Hwang S. <title>Temperature-induced deformation in shape memory alloys</title>. In: Anderson GL, Lagoudas DC, editors. Active Materials and Smart Structures. SPIE; 1995.

Published In

Active Materials and Smart Structures

DOI

ISSN

0277-786X

Publication Date

February 2, 1995

Publisher

SPIE

Conference Name

Symposium on Active Materials and Smart Structures: Society of Engineering Science 31st Annual Meeting

Related Subject Headings

  • 5102 Atomic, molecular and optical physics
  • 4009 Electronics, sensors and digital hardware
  • 4006 Communications engineering