Testing 3D-SoCs using 2-D time-division multiplexing
© 1982-2012 IEEE. Through-silicon vias (TSVs) are used as high-speed vertical interconnects between dies in a 3-D system-on-a-chip (SoC). However, their speed cannot be exploited during test application due to inherent limitations of the scan-chains of the cores, which prevent the use of high shift frequencies during the scan-in/out operations. Moreover, due to their high area cost, only a limited number of TSVs can be utilized for test application. As a result, TSVs become the bottleneck for transferring the large volume of test-data to the various layers of the stack, and the time for testing the 3-D chip increases a lot. In this paper, we propose an efficient test-access mechanism (TAM) architecture that exploits the high speed of TSVs to minimize the time for testing 3-D SoCs. The proposed TAM architecture is based on a 2-D time-division-multiplexing approach, and by the means of a very effective test-scheduling method, it offers significant savings in test-time, TSV-count and TAM-cost under power and thermal constraints. Extensive experiments on two 3-D benchmark SoCs show the benefits of the proposed method.
Georgiou, P; Vartziotis, F; Kavousianos, X; Chakrabarty, K
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