"Bottom-up" three-dimensional metamaterials at terahertz frequencies

Published

Conference Paper

In this paper, we present our recent progress on three-dimensional (3D) metamaterials at terahertz (THz) frequencies. Using a "bottom-up" multilayer electroplating technique, a flexible and a broadband tunable metamaterial was fabricated and characterized. In agreement well with numerical simulations, characterization on these 3D metamaterials by THz time domain spectroscopy (THz-TDS) indicates excellent performance of 3D metamaterials in manipulating electromagnetic waves. The successful fabrication of these 3D structures from well-defined building blocks provides a new pathway towards "bottom-up" 3D metamaterials for potential applications at THz frequencies. © 2011 IEEE.

Full Text

Cited Authors

  • Fan, K; Strikwerda, AC; Averitt, RD; Zhang, X

Published Date

  • September 1, 2011

Published In

  • 2011 16th International Solid State Sensors, Actuators and Microsystems Conference, Transducers'11

Start / End Page

  • 2662 - 2665

International Standard Book Number 13 (ISBN-13)

  • 9781457701573

Digital Object Identifier (DOI)

  • 10.1109/TRANSDUCERS.2011.5969740

Citation Source

  • Scopus