Selective Electroplating for 3D-Printed Electronics

Published

Journal Article

© 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim Creating 3D-printed parts with embedded circuitry is the next frontier in additive manufacturing, but printing of conductors with performance comparable to bulk metals such as copper is a difficult challenge. A hybrid process based on 3D printing followed by electroplating on highly conductive thermoplastic filament is used to manufacture 3D circuit boards and electronic packaging. Dual extruder heads on a standard fused filament fabrication printer are used to selectively define regions for electroplating, allowing distinct traces and multiple materials to be patterned in the same 3D-printed parts. Using this approach, a 3D-printed surface-mount package and a 555 timer oscillator circuit are demonstrated, including soldering of components onto the electroplated copper surface.

Full Text

Duke Authors

Cited Authors

  • Lazarus, N; Bedair, SS; Hawasli, SH; Kim, MJ; Wiley, BJ; Smith, GL

Published Date

  • January 1, 2019

Published In

Volume / Issue

  • 4 / 8

Electronic International Standard Serial Number (EISSN)

  • 2365-709X

Digital Object Identifier (DOI)

  • 10.1002/admt.201900126

Citation Source

  • Scopus