Progress and status of guided wave optical interconnection technology

Conference Paper

Optical interconnects at the cabinet-to-cabinet, board-to-board, and multichip module-to-multichip module levels will enable future avionics systems requirements to be met by eliminating undesirable compromises associated with electrical interconnects. Fiber optics is the well established medium of choice for cabinet-to-cabinet applications, while planar polymeric interconnects are required at the backplane level. Significant advances have been made in demonstrating practical polymer interconnects compatible with existing board fabrication principles, however both waveguide loss and interfaces to optoelectronic components require further improvement before the technology will be broadly applicable.

Full Text

Duke Authors

Cited Authors

  • Bristow, J; Sullivan, C; Mukherjee, S; Liu, Y; Husain, A

Published Date

  • July 1, 1993

Published In

Volume / Issue

  • 1849 /

Start / End Page

  • 4 - 10

Electronic International Standard Serial Number (EISSN)

  • 1996-756X

International Standard Serial Number (ISSN)

  • 0277-786X

Digital Object Identifier (DOI)

  • 10.1117/12.147108

Citation Source

  • Scopus