Active to passive element micro-assembly for photonic micro-systems

Journal Article (Journal Article)

New methods for integration of dissimilar components and optical inputs/outputs are expected to mass-produce photonic micro-systems at reduced levels of difficulty and therefore reduced cost. These methods involve monolithic and hybrid approaches, the latter at both wafer-to-wafer and chip-to-wafer levels. Broadly, these are called `heterogeneous integration' and encompass technologies as diverse as wafer-fusion and DNA-assisted micro-assembly. This review summarizes the associated micro-assembly techniques and discusses their possible influence upon cost- and yield-benefits to industry.

Duke Authors

Cited Authors

  • Mukherjee, SD; Bakke, T

Published Date

  • January 1, 1999

Published In

Volume / Issue

  • 3666 /

Start / End Page

  • 237 - 245

International Standard Serial Number (ISSN)

  • 0277-786X

Citation Source

  • Scopus