Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits

Conference Paper

Approaches for future 'mixed application' monolithic integrated circuits (ICs) employing optical receive/transmit, rf amplification and modulation and digital control functions are discussed. The paper focuses on compatibility of the photonic component fabrication with conventional rf and digital IC technologies. Recent progress at Honeywell in integrating several parts of the desired rf/digital/photonic circuit integration suite required for construction of a future millimeter-wave (mmW) optically-controlled phased- array element are illustrated.

Duke Authors

Cited Authors

  • Swirhun, S; Bendett, MP; Sokolov, V; Bauhahn, PE; Sullivan, CT; Mactaggart, R; Mukherjee, SD; Hibbs-Brenner, MK; Mondal, JP

Published Date

  • January 1, 1991

Published In

Volume / Issue

  • 1475 /

Start / End Page

  • 223 - 230

International Standard Serial Number (ISSN)

  • 0277-786X

International Standard Book Number 10 (ISBN-10)

  • 0819405841

Citation Source

  • Scopus