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Thermodynamic optimization of cooling techniques for electronic packages

Publication ,  Journal Article
Bejan, A; Ledezma, GA
Published in: International Journal of Heat and Mass Transfer
January 1, 1996

This paper describes several fundamental trade offs that govern the optimization of cooling techniques for heat generating electric devices. Five basic cooling configurations are optimized. It is shown that in forced air cooling above room temperature the fan power requirement is minimum when the heat transfer contact area is optimized to a value that is of the order of 102Af, where Af is the flow cross-sectional area. This optimal contact area is independent of whether the coolant is mixed or unmixed inside the heat generating enclosure. In air cooling with natural updraft, the heat generation rate (or amount of electronics, or overall thermal conductance) is maximum when the heat transfer contact area is of order 102Af. In forced convection cooling at cryogenic temperatures, the refrigerator power requirement has minima with respect to the cold-end (refrigeration load) temperature and the heat transfer contact area. The optimal heat transfer area is again of the order of 102,Af.

Duke Scholars

Published In

International Journal of Heat and Mass Transfer

DOI

ISSN

0017-9310

Publication Date

January 1, 1996

Volume

39

Issue

6

Start / End Page

1213 / 1221

Related Subject Headings

  • Mechanical Engineering & Transports
  • 51 Physical sciences
  • 49 Mathematical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences
  • 01 Mathematical Sciences
 

Citation

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ICMJE
MLA
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Bejan, A., & Ledezma, G. A. (1996). Thermodynamic optimization of cooling techniques for electronic packages. International Journal of Heat and Mass Transfer, 39(6), 1213–1221. https://doi.org/10.1016/0017-9310(95)00196-4
Bejan, A., and G. A. Ledezma. “Thermodynamic optimization of cooling techniques for electronic packages.” International Journal of Heat and Mass Transfer 39, no. 6 (January 1, 1996): 1213–21. https://doi.org/10.1016/0017-9310(95)00196-4.
Bejan A, Ledezma GA. Thermodynamic optimization of cooling techniques for electronic packages. International Journal of Heat and Mass Transfer. 1996 Jan 1;39(6):1213–21.
Bejan, A., and G. A. Ledezma. “Thermodynamic optimization of cooling techniques for electronic packages.” International Journal of Heat and Mass Transfer, vol. 39, no. 6, Jan. 1996, pp. 1213–21. Scopus, doi:10.1016/0017-9310(95)00196-4.
Bejan A, Ledezma GA. Thermodynamic optimization of cooling techniques for electronic packages. International Journal of Heat and Mass Transfer. 1996 Jan 1;39(6):1213–1221.
Journal cover image

Published In

International Journal of Heat and Mass Transfer

DOI

ISSN

0017-9310

Publication Date

January 1, 1996

Volume

39

Issue

6

Start / End Page

1213 / 1221

Related Subject Headings

  • Mechanical Engineering & Transports
  • 51 Physical sciences
  • 49 Mathematical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences
  • 01 Mathematical Sciences