Two-dimensional array transducers using thick film connection technology.

Published

Journal Article

A connection technique for two-dimensional array ultrasound transducers developed by combining a conductive lambda/4 mismatching layer with a multi-layer ceramic (MLC) connector using thick-film microelectronic technology is described. The connector consists of 20 thick films of alumina and screen printed metallization with customized interconnections between the layers called vias. Ten ground layers are interleaved between ten signal layers to reduce elecrical crosstalk. A lambda/4 mismatching layer of conductive epoxy is bonded between each PZT element and the silver metal pad of the MLC connector to provide an effective low impedance backing. In the current configuration, a 16x16 transducer array, 0.6 mm element spacing, is expanded to a 16x16 grid of connector pins at a standard spacing of 2.5 mm. Vector impedance, sensitivity, bandwidth, interelement uniformity, and crosstalk are all in good agreement with arrays of conventional fabrication. However, an array with MLC connector can be fabricated more quickly independent of the number of elements.

Full Text

Duke Authors

Cited Authors

  • Smith, SW; Light, ED

Published Date

  • January 1, 1993

Published In

Volume / Issue

  • 40 / 6

Start / End Page

  • 727 - 734

PubMed ID

  • 18263240

Pubmed Central ID

  • 18263240

Electronic International Standard Serial Number (EISSN)

  • 1525-8955

International Standard Serial Number (ISSN)

  • 0885-3010

Digital Object Identifier (DOI)

  • 10.1109/58.248217

Language

  • eng