A Three-Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect

Published

Journal Article

This paper presents a three-dimensional, highly parallel, optically interconnected system to process high-throughput stream data such as images. The vertical optical interconnections are realized using integrated optoelectronic devices operating at wavelengths to which silicon is transparent. These through-wafer optical signals are used to vertically optically interconnect stacked silicon circuits. The thin film optoelectronic devices are bonded directly to the stacked layers of silicon circuitry to realize self-contained vertical optical interconnections. Each integrated circuit layer contains analog interface circuitry, namely, detector amplifier and emitter driver circuitry, and digital circuitry for the network and/or processor, all of which are fabricated using a standard silicon integrated circuit foundry. These silicon circuits are post processed to integrate the thin film optoelectronics using standard, low cost, high yield microfabrication techniques. The three-dimensionally integrated architectures described herein are a network and a processor. The network has been designed to meet off-chip I/O using a new offset cube topology coupled with naming and routing schemes. The performance of this network is comparable to that of a three-dimensional mesh. The processing architecture has been defined to minimize overhead for basic parallel operations. The system goal for this research is to develop an integrated processing node for high-throughput, low-memory applications. © 1995 IEEE

Full Text

Duke Authors

Cited Authors

  • Wills, DS; Lacy, WS; Camperi-Ginestet, C; Buchanan, B; Cat, HH; Wilkinson, S; Lee, M; Jokerst, NM; Brooke, MA

Published Date

  • January 1, 1995

Published In

Volume / Issue

  • 13 / 6

Start / End Page

  • 1085 - 1092

Electronic International Standard Serial Number (EISSN)

  • 1558-2213

International Standard Serial Number (ISSN)

  • 0733-8724

Digital Object Identifier (DOI)

  • 10.1109/50.390224

Citation Source

  • Scopus