Three-dimensional high-throughput architecture using through-wafer optical interconnect

Journal Article

A three-dimensional, highly parallel, optically interconnected systems to process high-throughput stream data such as images is presented. This three-dimensionally integrated architectures is a network and a processor. The network has been designed to meet off-chip I/O using a new offset cube topology coupled with naming and routing schemes. The performance of this network is comparable to that of a three-dimensional mesh. The processing architecture has been defined to minimize overhead for basic parallel operations. The purpose of this paper is to develop an integrated processing node for high-throughput, low-memory applications.

Full Text

Duke Authors

Cited Authors

  • Wills, DS; Lacy, WS; Camperi-Ginestet, C; Buchanan, B; Cat, HH; Wilkinson, S; Lee, M; Jokerst, NM; Brooke, MA

Published Date

  • 1995

Published In

  • Journal of Lightwave Technology

Volume / Issue

  • 13 / 6

Start / End Page

  • 1085 - 1092

Digital Object Identifier (DOI)

  • 10.1109/50.390224