Manufacturable multi-material integration: Compound semiconductor devices bonded to silicon circuitry

Published

Journal Article

© 1995 SPIE. All rights reserved. The integration of thin film optoelectronic devices with host substrates such as circuits, waveguides, and micromachines offers to the systems engineer the freedom to choose the optimal materials to achieve performance and cost objectives. In essence, the bonding of the thin film components becomes and integral part of the system packaging. The fabrication and integration of thin film compound semiconductor optoelectronic devices with a number of host substrates is presented. Thin film devices have been integrated with silicon circuits, and movable micromachines, and have been used to demonstrate three dimensionally interconnected systems. The three dimensionally integrated systems include detector arrays bonded directly on top of circuits for massively parallel processing of images, and vertical optical interconnections have been demonstrated between stacked layers of silicon circuits (which are transparent to the wavelength of light used) for a massively parallel processing architecture based upon low memory and high input/output.

Full Text

Duke Authors

Cited Authors

  • Jokerst, NM; Brooke, M; Vendier, O; Wilkinson, ST; Fike, SM; Lee, M; Buchanan, B; Wills, S; Brown, A

Published Date

  • September 15, 1995

Published In

Volume / Issue

  • 2524 /

Start / End Page

  • 152 - 163

Electronic International Standard Serial Number (EISSN)

  • 1996-756X

International Standard Serial Number (ISSN)

  • 0277-786X

Digital Object Identifier (DOI)

  • 10.1117/12.219568

Citation Source

  • Scopus