Manufacturable multi-material integration: Compound semiconductor devices bonded to silicon circuitry

Journal Article

Full Text

Duke Authors

Cited Authors

  • JOKERST, NM; BROOKE, M; VENDIER, O; WILKINSON, ST; FIKE, SM; LEE, M; BUCHANAN, B; WILLS, S; BROWN, A

Published Date

  • 1995

Published In

  • NATIONAL SCIENCE FOUNDATION (NSF) FORUM ON OPTICAL SCIENCE AND ENGINEERING

Volume / Issue

  • 2524 /

Start / End Page

  • 152 - 163

Digital Object Identifier (DOI)

  • 10.1117/12.219568