Microsystem Optoelectronic Integration for Mixed Multisignal Systems

Journal Article

The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent results using thin-film device heterogeneous integration with Si CMOS VLSI and GaAs MESFET circuit technologies are presented in this paper. Applications explored herein include alignment tolerant optoelectronic links for network interconnections, smart pixel focal plane array processing through the integration of imaging arrays with sigma delta analog to digital converters underneath each pixel, and three-dimensional computational systems using vertical through-Si optical interconnections.

Full Text

Duke Authors

Cited Authors

  • Jokerst, NM; Brooke, MA; Laskar, J; Wills, DS; Brown, AS; Vrazel, M; Jung, S; Joo, Y; Chang, JJ

Published Date

  • 2000

Published In

Volume / Issue

  • 6 / 6

Start / End Page

  • 1231 - 1237

International Standard Serial Number (ISSN)

  • 1077-260X

Digital Object Identifier (DOI)

  • 10.1109/2944.902172