Embedded optical interconnections using thin film InGaAs metal-semiconductor-metal photodetectors

Journal Article

The integration of InGaAs photodetectors embedded in a polymer interconnection waveguide on Si and ceramic electrical interconnection substrates has been demonstrated. The photodetector and substrate are independently fabricated and bonded, with subsequent waveguide integration. The embedding fabrication process, coupling, and bandwidth are reported at 1 Gbit/s.

Full Text

Duke Authors

Cited Authors

  • Huang, Z; Ueno, Y; Kaneko, K; Jokerst, NM; Tanahashi, S

Published Date

  • 2002

Published In

  • Electronics Letters

Volume / Issue

  • 38 / 25

Start / End Page

  • 1708 - 1709

Digital Object Identifier (DOI)

  • 10.1049/el:20021047