The effect of ion-implantation damage on dopant diffusion in silicon during shallow-junction formation

Published

Journal Article

Low-thermal-budget annealing of ion-implanted BF 2 +, P, and As in Si was studied for shallow-junction formation. Implant doses were sufficient to amorphize the silicon surface region. Low-temperature furnace annealing and rapid-thermal annealing of ionimplanted boron, phosphorus and arsenic in silicon exhibit a transient enhanced diffusion regime resulting injunction depths considerably deeper than expected. The origin of this transient enhanced diffusion is the annealing of ion-implantation damage in the silicon substrate. We have found that point-defect generation during the annealing of either shallow end-of-range damage or small clusters of point defects dominates the transient enhanced diffusion process depending upon the annealing temperature and time. The net effect of damage annealing is to reduce the activation energy for dopant diffusion by an amount equal to the activation energy of the supersaturation of point defects in silicon. Models which can describe the transient enhancement characteristics in dopant diffusion during both furnace and rapid-thermal annealing of these implants are discussed. © 1989 AIME.

Full Text

Duke Authors

Cited Authors

  • Kim, Y; Massoud, HZ; Fair, RB

Published Date

  • March 1, 1989

Published In

Volume / Issue

  • 18 / 2

Start / End Page

  • 143 - 150

Electronic International Standard Serial Number (EISSN)

  • 1543-186X

International Standard Serial Number (ISSN)

  • 0361-5235

Digital Object Identifier (DOI)

  • 10.1007/BF02657400

Citation Source

  • Scopus