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Integration and packaging of MEMS relays

Publication ,  Journal Article
Kim, J; Bolle, CA; Boie, RA; Gates, JV; Ramirez, AG; Jin, S; Bishop, DJ
Published in: Proceedings of SPIE - The International Society for Optical Engineering
2000

Micromachined relays provide switching solutions that are advantageous over existing technology in many aspects of device performance. In order to fully benefit from the MEMS solution in switching, however, a general integration strategy to various integrated circuit (IC) electronics needs to be developed. We describe the design and test of such an integration scheme utilizing flip-chip bonding of MEMS relays onto another substrate carrying the remainder of the circuitry. Individual devices consist of cantilever-like mechanical structure carrying a mobile electrode that is electrostatically actuated. The presence of a second substrate in the flip-chip bonded geometry provides the unique possibility of placing electrostatic actuators on both sides of the cantilever, thereby allowing active turn-on and turn-off of the relay device. The fabricated relays show switching time as short as 10 μs, actuation voltages as low as 25 V, on-state DC resistance as low as 2 Ω and open-state DC resistance as large as 1013 Ω. The device is assembled and packaged using a single-step flip-chip bonding process. Upon flip-chip bonding, the MEMS devices are completely enclosed in a small cavity between the two substrates that is sealed by a ring-type solder seal. Such technique provides the opportunity for the integrated chip to be further packaged using conventional cost-effective packaging techniques.

Duke Scholars

Published In

Proceedings of SPIE - The International Society for Optical Engineering

Publication Date

2000

Volume

4019

Start / End Page

333 / 341
 

Citation

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Kim, J., Bolle, C. A., Boie, R. A., Gates, J. V., Ramirez, A. G., Jin, S., & Bishop, D. J. (2000). Integration and packaging of MEMS relays. Proceedings of SPIE - The International Society for Optical Engineering, 4019, 333–341.
Kim, J., C. A. Bolle, R. A. Boie, J. V. Gates, A. G. Ramirez, S. Jin, and D. J. Bishop. “Integration and packaging of MEMS relays.” Proceedings of SPIE - The International Society for Optical Engineering 4019 (2000): 333–41.
Kim J, Bolle CA, Boie RA, Gates JV, Ramirez AG, Jin S, et al. Integration and packaging of MEMS relays. Proceedings of SPIE - The International Society for Optical Engineering. 2000;4019:333–41.
Kim, J., et al. “Integration and packaging of MEMS relays.” Proceedings of SPIE - The International Society for Optical Engineering, vol. 4019, 2000, pp. 333–41.
Kim J, Bolle CA, Boie RA, Gates JV, Ramirez AG, Jin S, Bishop DJ. Integration and packaging of MEMS relays. Proceedings of SPIE - The International Society for Optical Engineering. 2000;4019:333–341.

Published In

Proceedings of SPIE - The International Society for Optical Engineering

Publication Date

2000

Volume

4019

Start / End Page

333 / 341