Thermal-safe test scheduling for core-based system-on-chip integrated circuits

Published

Journal Article

Overheating has been acknowledged as a major problem during the testing of complex system-on-chip integrated circuits. Several power-constrained test-scheduling solutions have been recently proposed to tackle this problem during system integration. However, we show that these approaches cannot guarantee hot-spot-free test schedules because they do not take into account the nonuniform distribution of heat dissipation across the die and the physical adjacency of simultaneously active cores. This paper proposes a new test-scheduling approach that is able to produce short test schedules and guarantee thermal safety at the same time. Two thermal-safe test-scheduling algorithms are proposed. The first algorithm computes an exact (shortest) test schedule that is guaranteed to satisfy a given maximum temperature constraint. The second algorithm is a heuristic intended for complex systems with a large number of embedded cores, for which the exact thermal-safe test-scheduling algorithm may not be feasible. Based on a low-complexity test-session thermal-cost model, this algorithm produces near-optimal length test schedules with significantly less computational effort compared to the optimal algorithm. © 2006 IEEE.

Full Text

Duke Authors

Cited Authors

  • Rosinger, P; Al-Hashimi, BM; Chakrabarty, K

Published Date

  • November 1, 2006

Published In

Volume / Issue

  • 25 / 11

Start / End Page

  • 2502 - 2511

International Standard Serial Number (ISSN)

  • 0278-0070

Digital Object Identifier (DOI)

  • 10.1109/TCAD.2006.873898

Citation Source

  • Scopus