Mixed material integration for power amplifier MMICs
Publication
, Journal Article
Matinpour, B; Bergman, J; Chun, C; Laskar, J; Jokerst, NM
Published in: IEEE MTT-S International Microwave Symposium Digest
December 1, 1999
In this paper we present the first large signal analysis of thin film HBTs by experimental load pull measurements. InP HBTs are fully characterized before and after substrate removal and integration onto electrically insulating substrates, and show preserved small and large signal performance. In addition, we demonstrate the feasibility of integrating thin film power devices and MMICs on thermally conductive substrates for development of high efficiency power amplifiers.
Duke Scholars
Published In
IEEE MTT-S International Microwave Symposium Digest
ISSN
0149-645X
Publication Date
December 1, 1999
Volume
2
Start / End Page
625 / 628
Citation
APA
Chicago
ICMJE
MLA
NLM
Matinpour, B., Bergman, J., Chun, C., Laskar, J., & Jokerst, N. M. (1999). Mixed material integration for power amplifier MMICs. IEEE MTT-S International Microwave Symposium Digest, 2, 625–628.
Matinpour, B., J. Bergman, C. Chun, J. Laskar, and N. M. Jokerst. “Mixed material integration for power amplifier MMICs.” IEEE MTT-S International Microwave Symposium Digest 2 (December 1, 1999): 625–28.
Matinpour B, Bergman J, Chun C, Laskar J, Jokerst NM. Mixed material integration for power amplifier MMICs. IEEE MTT-S International Microwave Symposium Digest. 1999 Dec 1;2:625–8.
Matinpour, B., et al. “Mixed material integration for power amplifier MMICs.” IEEE MTT-S International Microwave Symposium Digest, vol. 2, Dec. 1999, pp. 625–28.
Matinpour B, Bergman J, Chun C, Laskar J, Jokerst NM. Mixed material integration for power amplifier MMICs. IEEE MTT-S International Microwave Symposium Digest. 1999 Dec 1;2:625–628.
Published In
IEEE MTT-S International Microwave Symposium Digest
ISSN
0149-645X
Publication Date
December 1, 1999
Volume
2
Start / End Page
625 / 628