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Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate

Publication ,  Journal Article
Shin, J; Kim, JH; Cha, C; Jokerst, NM; Brooke, M
Published in: Proceedings - Electronic Components and Technology Conference
September 19, 2005

In this paper, a predictive (scalable) measurement-based model for high frequency interconnects on low cost FR4 substrates is proposed and demonstrated. In our research, the interconnects are modeled with equivalent circuits of scalable building blocks using a rapid and accurate optimization method to fit parameters up to 10 GHz. This predictive model then is applied for the extended structures to enhance their flexibility. The usefulness of the proposed modeling methodology is validated by comparing predictions to measurements both in frequency domain and in time domain. The speed and accuracy of the method also are compared with the Advanced Design System's momentum simulation tool. The results show that this proposed modeling for the high frequency interconnects are efficient and accurate compared to the momentum simulation. © 2005 IEEE.

Duke Scholars

Published In

Proceedings - Electronic Components and Technology Conference

ISSN

0569-5503

Publication Date

September 19, 2005

Volume

2

Start / End Page

1835 / 1841
 

Citation

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MLA
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Shin, J., Kim, J. H., Cha, C., Jokerst, N. M., & Brooke, M. (2005). Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate. Proceedings - Electronic Components and Technology Conference, 2, 1835–1841.
Shin, J., J. H. Kim, C. Cha, N. M. Jokerst, and M. Brooke. “Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate.” Proceedings - Electronic Components and Technology Conference 2 (September 19, 2005): 1835–41.
Shin J, Kim JH, Cha C, Jokerst NM, Brooke M. Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate. Proceedings - Electronic Components and Technology Conference. 2005 Sep 19;2:1835–41.
Shin, J., et al. “Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate.” Proceedings - Electronic Components and Technology Conference, vol. 2, Sept. 2005, pp. 1835–41.
Shin J, Kim JH, Cha C, Jokerst NM, Brooke M. Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate. Proceedings - Electronic Components and Technology Conference. 2005 Sep 19;2:1835–1841.

Published In

Proceedings - Electronic Components and Technology Conference

ISSN

0569-5503

Publication Date

September 19, 2005

Volume

2

Start / End Page

1835 / 1841