Heterogeneous integration: From substrate technology to active packaging
Journal Article (Journal Article)
Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced packaging. Herein, we outline our approaches towards heterogeneous integration.
Full Text
Duke Authors
Cited Authors
- Brown, AS; Jokerst, NM; Doolittle, A; Brooke, M; Kuech, TF; Seo, SW; Kang, S; Huang, S; Shen, JJ
Published Date
- January 1, 2001
Published In
Start / End Page
- 197 - 200
International Standard Serial Number (ISSN)
- 0163-1918
Digital Object Identifier (DOI)
- 10.1109/IEDM.2001.979465
Citation Source
- Scopus