Heterogeneous integration: From substrate technology to active packaging

Journal Article

Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced packaging. Herein, we outline our approaches towards heterogeneous integration.

Duke Authors

Cited Authors

  • Brown, AS; Jokerst, NM; Doolittle, A; Brooke, M; Kuech, TF; Seo, S-W; Kang, S; Huang, S; Shen, J-J

Published Date

  • 2001

Published In

  • Technical Digest - International Electron Devices Meeting

Start / End Page

  • 197 - 200