Heterogeneous integration: From substrate technology to active packaging
Publication
, Journal Article
Brown, AS; Jokerst, NM; Doolittle, A; Brooke, M; Kuech, TF; Seo, SW; Kang, S; Huang, S; Shen, JJ
Published in: Technical Digest-International Electron Devices Meeting
January 1, 2001
Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced packaging. Herein, we outline our approaches towards heterogeneous integration.
Duke Scholars
Published In
Technical Digest-International Electron Devices Meeting
DOI
ISSN
0163-1918
Publication Date
January 1, 2001
Start / End Page
197 / 200
Citation
APA
Chicago
ICMJE
MLA
NLM
Brown, A. S., Jokerst, N. M., Doolittle, A., Brooke, M., Kuech, T. F., Seo, S. W., … Shen, J. J. (2001). Heterogeneous integration: From substrate technology to active packaging. Technical Digest-International Electron Devices Meeting, 197–200. https://doi.org/10.1109/IEDM.2001.979465
Brown, A. S., N. M. Jokerst, A. Doolittle, M. Brooke, T. F. Kuech, S. W. Seo, S. Kang, S. Huang, and J. J. Shen. “Heterogeneous integration: From substrate technology to active packaging.” Technical Digest-International Electron Devices Meeting, January 1, 2001, 197–200. https://doi.org/10.1109/IEDM.2001.979465.
Brown AS, Jokerst NM, Doolittle A, Brooke M, Kuech TF, Seo SW, et al. Heterogeneous integration: From substrate technology to active packaging. Technical Digest-International Electron Devices Meeting. 2001 Jan 1;197–200.
Brown, A. S., et al. “Heterogeneous integration: From substrate technology to active packaging.” Technical Digest-International Electron Devices Meeting, Jan. 2001, pp. 197–200. Scopus, doi:10.1109/IEDM.2001.979465.
Brown AS, Jokerst NM, Doolittle A, Brooke M, Kuech TF, Seo SW, Kang S, Huang S, Shen JJ. Heterogeneous integration: From substrate technology to active packaging. Technical Digest-International Electron Devices Meeting. 2001 Jan 1;197–200.
Published In
Technical Digest-International Electron Devices Meeting
DOI
ISSN
0163-1918
Publication Date
January 1, 2001
Start / End Page
197 / 200