Heterogeneous integration: From substrate technology to active packaging

Published

Journal Article

Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced packaging. Herein, we outline our approaches towards heterogeneous integration.

Full Text

Duke Authors

Cited Authors

  • Brown, AS; Jokerst, NM; Doolittle, A; Brooke, M; Kuech, TF; Seo, SW; Kang, S; Huang, S; Shen, JJ

Published Date

  • January 1, 2001

Published In

Start / End Page

  • 197 - 200

International Standard Serial Number (ISSN)

  • 0163-1918

Digital Object Identifier (DOI)

  • 10.1109/IEDM.2001.979465

Citation Source

  • Scopus