Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates
Journal Article
High frequency signal distribution in HDI/HDW substrates can be achieved using optical interconnections. To realize effective milli- and micro-haul interconnections on these substrates, the hybrid integration of independently optimized interface circuits and optoelectronic detectors is critical. Further, to realize effective cost goals, designing the optoelectronic interface for alignment tolerance is a key goal. This paper describes the design, fabrication, and test of hybrid integrated optoelectronic interface circuits designed for alignment tolerance and for integration onto an HDI/HDW substrate.
Duke Authors
Cited Authors
- Vrazel, M; Chang, JJ; Brooke, M; Jokerst, NM; Joo, Y; Carastro, L; Dagnall, G; Brown, A
Published Date
- December 1, 2000
Published In
Start / End Page
- 223 - 230
International Standard Serial Number (ISSN)
- 0569-5503
Citation Source
- Scopus