Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits

Journal Article

A 'smart' multispectral imaging system that can be fabricated with independently optimized detector arrays and Si CMOS circuits is described. This imager utilizes the heterogeneous integration of thin film GaN (UV), MCT (MWIR), and Si CMOS circuitry to create an outstanding example of the power of heterogeneous integration for enhancing optical systems using electronic signal processing capabilities.

Duke Authors

Cited Authors

  • Lee, K; Seo, S; Huang, S; Joo, Y; Doolittle, WA; Fike, S; Jokerst, N; Brooke, M; Brown, A; Jensen, JE; Lyon, TJD

Published Date

  • 2000

Published In

  • LEOS Summer Topical Meeting

Start / End Page

  • 57 - 58