Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect

Journal Article

High density interconnect (HDI) electrical interconnections and vertical optoelectronic (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon the Semiconductor Industry Association (SIA) Roadmap projections, which indicate interconnection as a challenge area for coming generations of electronics, optoelectronics may serve a role in chip to chip interconnections for massively parallel computational systems.

Duke Authors

Cited Authors

  • Brooke, M; Jokerst, NM; Bond, SW; Wills, DS

Published Date

  • January 1, 1998

Published In

  • Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volume / Issue

  • 2 /

Start / End Page

  • 186 - 187