Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect
Publication
, Journal Article
Brooke, M; Jokerst, NM; Bond, SW; Wills, DS
Published in: Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
December 1, 1998
High density interconnect (HDI) electrical interconnections and vertical optoelectronic (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon the Semiconductor Industry Association (SIA) Roadmap projections, which indicate interconnection as a challenge area for coming generations of electronics, optoelectronics may serve a role in chip to chip interconnections for massively parallel computational systems.
Duke Scholars
Published In
Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
ISSN
1092-8081
Publication Date
December 1, 1998
Volume
2
Start / End Page
186 / 187
Citation
APA
Chicago
ICMJE
MLA
NLM
Brooke, M., Jokerst, N. M., Bond, S. W., & Wills, D. S. (1998). Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, 2, 186–187.
Brooke, M., N. M. Jokerst, S. W. Bond, and D. S. Wills. “Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS 2 (December 1, 1998): 186–87.
Brooke M, Jokerst NM, Bond SW, Wills DS. Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 1998 Dec 1;2:186–7.
Brooke, M., et al. “Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, vol. 2, Dec. 1998, pp. 186–87.
Brooke M, Jokerst NM, Bond SW, Wills DS. Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 1998 Dec 1;2:186–187.
Published In
Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
ISSN
1092-8081
Publication Date
December 1, 1998
Volume
2
Start / End Page
186 / 187