High density focal plane signal processing using 3-D vertical interconnects
Journal Article
A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to alogrithmically encoded frequency signal.
Duke Authors
Cited Authors
- Buchanan, B; Camperi-Ginestet, C; Morris, T; Brooke, M; DeWeerth, S; Jokerst, N; Allen, M
Published Date
- December 1, 1994
Published In
- Midwest Symposium on Circuits and Systems
Volume / Issue
- 1 /
Start / End Page
- 191 - 194
Citation Source
- Scopus