High density focal plane signal processing using 3-D vertical interconnects

Journal Article

A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to alogrithmically encoded frequency signal.

Duke Authors

Cited Authors

  • Buchanan, B; Camperi-Ginestet, C; Morris, T; Brooke, M; DeWeerth, S; Jokerst, N; Allen, M

Published Date

  • December 1, 1994

Published In

  • Midwest Symposium on Circuits and Systems

Volume / Issue

  • 1 /

Start / End Page

  • 191 - 194

Citation Source

  • Scopus