Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis

Published

Journal Article

Three-dimensional (3D) ICs promise to overcome barriers in Interconnect scaling by leveraging fast, dense inter-die vias, thereby offering benefits of improved performance, higher memory bandwidth, smaller form factors, and heterogeneous integration. However, when deciding to adopt this emerging technology as a mainstream design approach, designers must consider the cost of 3D integration. IC testing is a key factor that affects the final product cost, and it could be a major portion of the total IC cost. In 3D IC design, various testing strategies and different integration methods could affect the final product cost dramatically, and the interaction with other cost factors could result in various trade-offs. This paper develops a comprehensive and parameterized testing cost model for 3D IC integration, and analyzes the trade-offs associated with testing strategies and testing circuit overheads. With the proposed testing cost model, designers can explore the most cost-effective integration and testing strategies for 3D IC chips. ©2010 IEEE.

Full Text

Duke Authors

Cited Authors

  • Chen, Y; Niu, D; Xie, Y; Chakrabarty, K

Published Date

  • December 1, 2010

Published In

Start / End Page

  • 471 - 475

International Standard Serial Number (ISSN)

  • 1092-3152

Digital Object Identifier (DOI)

  • 10.1109/ICCAD.2010.5653753

Citation Source

  • Scopus