Proof-concept collaboration model for advanced packaging research at MCNC


Journal Article

MCNC's research in flip chip processing has occurred over several years within the center and in concert with several universities. In order to make the research available to industry, a flip chip technology center (FCTC) has been established within MCNC to help industry evaluate the technology applied to their own ICs. The model for FCTC is the proof-of-concept model which allows for promising technologies to be actively transferred with the cooperation and shared costs of industry with leverage from the federal government.

Duke Authors

Cited Authors

  • Fair, RB; Turlik, I

Published Date

  • December 1, 1993

Published In

Volume / Issue

  • 1986 /

Start / End Page

  • 552 - 555

International Standard Serial Number (ISSN)

  • 0277-786X

Citation Source

  • Scopus