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Proof-concept collaboration model for advanced packaging research at MCNC

Publication ,  Journal Article
Fair, RB; Turlik, I
Published in: Proceedings of SPIE - The International Society for Optical Engineering
December 1, 1993

MCNC's research in flip chip processing has occurred over several years within the center and in concert with several universities. In order to make the research available to industry, a flip chip technology center (FCTC) has been established within MCNC to help industry evaluate the technology applied to their own ICs. The model for FCTC is the proof-of-concept model which allows for promising technologies to be actively transferred with the cooperation and shared costs of industry with leverage from the federal government.

Duke Scholars

Published In

Proceedings of SPIE - The International Society for Optical Engineering

ISSN

0277-786X

Publication Date

December 1, 1993

Volume

1986

Start / End Page

552 / 555
 

Citation

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Fair, R. B., & Turlik, I. (1993). Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering, 1986, 552–555.
Fair, R. B., and I. Turlik. “Proof-concept collaboration model for advanced packaging research at MCNC.” Proceedings of SPIE - The International Society for Optical Engineering 1986 (December 1, 1993): 552–55.
Fair RB, Turlik I. Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering. 1993 Dec 1;1986:552–5.
Fair, R. B., and I. Turlik. “Proof-concept collaboration model for advanced packaging research at MCNC.” Proceedings of SPIE - The International Society for Optical Engineering, vol. 1986, Dec. 1993, pp. 552–55.
Fair RB, Turlik I. Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering. 1993 Dec 1;1986:552–555.

Published In

Proceedings of SPIE - The International Society for Optical Engineering

ISSN

0277-786X

Publication Date

December 1, 1993

Volume

1986

Start / End Page

552 / 555