InP HBT on Si substrates with integral passive components: A wafer scale package
Publication
, Journal Article
Chun, C; Evers, N; Laskar, J; Jokerst, NM; Chau, HF; Beam, E
Published in: IEEE MTT-S International Microwave Symposium Digest
January 1, 1997
An InP-based HBT is integrated to a Si substrate insulated with BCB by removing the InP substrate and bonding the active device layers. The DC and RF characteristics show minimal degradation after bonding to the Si. Transmission line structures are fabricated and measured on both bare Si and Si coated with BCB. Insertion loss of the CPW lines demonstrate useful high frequency propagation with BCB on the lossy substrate. Utilizing these results, an amplifier is designed to demonstrate InP thin-film integrated high frequency circuits on silicon. These results point to the development of wafer scale packaged high frequency electronics.
Duke Scholars
Published In
IEEE MTT-S International Microwave Symposium Digest
ISSN
0149-645X
Publication Date
January 1, 1997
Volume
2
Start / End Page
513 / 516
Citation
APA
Chicago
ICMJE
MLA
NLM
Chun, C., Evers, N., Laskar, J., Jokerst, N. M., Chau, H. F., & Beam, E. (1997). InP HBT on Si substrates with integral passive components: A wafer scale package. IEEE MTT-S International Microwave Symposium Digest, 2, 513–516.
Chun, C., N. Evers, J. Laskar, N. M. Jokerst, H. F. Chau, and E. Beam. “InP HBT on Si substrates with integral passive components: A wafer scale package.” IEEE MTT-S International Microwave Symposium Digest 2 (January 1, 1997): 513–16.
Chun C, Evers N, Laskar J, Jokerst NM, Chau HF, Beam E. InP HBT on Si substrates with integral passive components: A wafer scale package. IEEE MTT-S International Microwave Symposium Digest. 1997 Jan 1;2:513–6.
Chun, C., et al. “InP HBT on Si substrates with integral passive components: A wafer scale package.” IEEE MTT-S International Microwave Symposium Digest, vol. 2, Jan. 1997, pp. 513–16.
Chun C, Evers N, Laskar J, Jokerst NM, Chau HF, Beam E. InP HBT on Si substrates with integral passive components: A wafer scale package. IEEE MTT-S International Microwave Symposium Digest. 1997 Jan 1;2:513–516.
Published In
IEEE MTT-S International Microwave Symposium Digest
ISSN
0149-645X
Publication Date
January 1, 1997
Volume
2
Start / End Page
513 / 516