Thin film multi-material OEICs

Journal Article

A promising method for integrating semiconductor devices, both electronic and optoelectronic, with arbitrary host substrates such as integrated circuits, polymers, and glass, is thin film device integration. Single crystal, thin film semiconductor devices can be separated from the growth substrate and bonded to host substrates using standard microelectronic processing, which is an attractive option for multi-material integrated optoelectronics. The epitaxial lift off (ELO) of Si, GaAs, and InP-based thin films and the bonding of these thin film devices to host substrates has been demonstrated and is reviewed here. In addition, thin film device performance before and after separation from the growth substrate is examined.

Duke Authors

Cited Authors

  • Jokerst, NM

Published Date

  • December 1, 1994

Published In

  • Ieee Leos Annual Meeting Proceedings

Volume / Issue

  • 1 /

Start / End Page

  • 69 - 70

Citation Source

  • Scopus