Metallic bonding of ceramic armor using reactive multilayer foils


Journal Article

The room temperature brazing and soldering of ceramic armor to metallic plates is described. The novel metallic bonding process uses reactive multilayer foils (NanoFoil™) as local heat sources to melt braze or solder layers placed between the ceramic and metal components. By replacing furnace cycles with local heating this NanoBond™ process eliminates significant heating of the components and thus large area components can be bonded relatively stress-free. Examples of bonding Al2O3to aluminum and of bonding SiC to titanium are presented and several configurations involving different braze and solder layers have been investigated in detail for the bonding of SiC to titanium. Shear strengths have been measured and are found to be significantly higher compared to those measured for similar samples bonded by epoxy adhesives. Numerical predictions of heat flow are also described for the reactive joining process and are validated by IR measurements. Lastly, bond areas over 100 cm2are demonstrated.

Duke Authors

Cited Authors

  • Duckham, A; Brown, M; Besnoin, E; Van Heerden, D; Knio, OM; Weihs, TP

Published Date

  • December 1, 2004

Published In

Volume / Issue

  • 25 / 3

Start / End Page

  • 597 - 603

International Standard Serial Number (ISSN)

  • 0196-6219

Citation Source

  • Scopus