High-density flexible interconnect for two-dimensional ultrasound arrays.


Journal Article (Letter)

We present a method for fabricating flexible multilayer circuits for interconnection to 2-D array ultrasound transducers. In addition, we describe four 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at up to 7 MHz and intracardiac catheter arrays with 70 channels operating at up to 7 MHz. We employ thin and thick film microfabrication techniques to batch produce the interconnect circuits with minimum dimensions of 12-mum lines, 40-mum vias, and 150-mum array pitch. The arrays show 50-Omega insertion loss of -60 to -84 dB and a fractional bandwidth of 27 to 67%. The arrays are used to obtain real time, in vivo volumetric scans.

Full Text

Duke Authors

Cited Authors

  • Fiering, JO; Hultman, P; Lee, W; Light, ED; Smith, SW

Published Date

  • January 2000

Published In

Volume / Issue

  • 47 / 3

Start / End Page

  • 764 - 770

PubMed ID

  • 18238607

Pubmed Central ID

  • 18238607

Electronic International Standard Serial Number (EISSN)

  • 1525-8955

International Standard Serial Number (ISSN)

  • 0885-3010

Digital Object Identifier (DOI)

  • 10.1109/58.842067


  • eng