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Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems.

Publication ,  Journal Article
Fang, H; Zhao, J; Yu, KJ; Song, E; Farimani, AB; Chiang, C-H; Jin, X; Xue, Y; Xu, D; Du, W; Seo, KJ; Zhong, Y; Yang, Z; Won, SM; Fang, G ...
Published in: Proceedings of the National Academy of Sciences of the United States of America
October 2016

Materials that can serve as long-lived barriers to biofluids are essential to the development of any type of chronic electronic implant. Devices such as cardiac pacemakers and cochlear implants use bulk metal or ceramic packages as hermetic enclosures for the electronics. Emerging classes of flexible, biointegrated electronic systems demand similar levels of isolation from biofluids but with thin, compliant films that can simultaneously serve as biointerfaces for sensing and/or actuation while in contact with the soft, curved, and moving surfaces of target organs. This paper introduces a solution to this materials challenge that combines (i) ultrathin, pristine layers of silicon dioxide (SiO2) thermally grown on device-grade silicon wafers, and (ii) processing schemes that allow integration of these materials onto flexible electronic platforms. Accelerated lifetime tests suggest robust barrier characteristics on timescales that approach 70 y, in layers that are sufficiently thin (less than 1 μm) to avoid significant compromises in mechanical flexibility or in electrical interface fidelity. Detailed studies of temperature- and thickness-dependent electrical and physical properties reveal the key characteristics. Molecular simulations highlight essential aspects of the chemistry that governs interactions between the SiO2 and surrounding water. Examples of use with passive and active components in high-performance flexible electronic devices suggest broad utility in advanced chronic implants.

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Published In

Proceedings of the National Academy of Sciences of the United States of America

DOI

EISSN

1091-6490

ISSN

0027-8424

Publication Date

October 2016

Volume

113

Issue

42

Start / End Page

11682 / 11687

Related Subject Headings

  • Temperature
  • Silicon Dioxide
  • Models, Theoretical
  • Electronics, Medical
  • Electricity
  • Computer Simulation
  • Body Fluids
 

Citation

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Fang, H., Zhao, J., Yu, K. J., Song, E., Farimani, A. B., Chiang, C.-H., … Rogers, J. A. (2016). Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems. Proceedings of the National Academy of Sciences of the United States of America, 113(42), 11682–11687. https://doi.org/10.1073/pnas.1605269113
Fang, Hui, Jianing Zhao, Ki Jun Yu, Enming Song, Amir Barati Farimani, Chia-Han Chiang, Xin Jin, et al. “Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems.Proceedings of the National Academy of Sciences of the United States of America 113, no. 42 (October 2016): 11682–87. https://doi.org/10.1073/pnas.1605269113.
Fang H, Zhao J, Yu KJ, Song E, Farimani AB, Chiang C-H, et al. Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems. Proceedings of the National Academy of Sciences of the United States of America. 2016 Oct;113(42):11682–7.
Fang, Hui, et al. “Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems.Proceedings of the National Academy of Sciences of the United States of America, vol. 113, no. 42, Oct. 2016, pp. 11682–87. Epmc, doi:10.1073/pnas.1605269113.
Fang H, Zhao J, Yu KJ, Song E, Farimani AB, Chiang C-H, Jin X, Xue Y, Xu D, Du W, Seo KJ, Zhong Y, Yang Z, Won SM, Fang G, Choi SW, Chaudhuri S, Huang Y, Alam MA, Viventi J, Aluru NR, Rogers JA. Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems. Proceedings of the National Academy of Sciences of the United States of America. 2016 Oct;113(42):11682–11687.
Journal cover image

Published In

Proceedings of the National Academy of Sciences of the United States of America

DOI

EISSN

1091-6490

ISSN

0027-8424

Publication Date

October 2016

Volume

113

Issue

42

Start / End Page

11682 / 11687

Related Subject Headings

  • Temperature
  • Silicon Dioxide
  • Models, Theoretical
  • Electronics, Medical
  • Electricity
  • Computer Simulation
  • Body Fluids