<title>Temperature-induced deformation in shape memory alloys</title>
Publication
, Conference
Brinson, LC; Bekker, AM; Hwang, S
Published in: SPIE Proceedings
February 2, 1995
Duke Scholars
Published In
SPIE Proceedings
DOI
ISSN
0277-786X
Publication Date
February 2, 1995
Volume
2427
Start / End Page
234 / 244
Publisher
SPIE
Conference Name
Symposium on Active Materials and Smart Structures: Society of Engineering Science 31st Annual Meeting
Related Subject Headings
- 5102 Atomic, molecular and optical physics
- 4009 Electronics, sensors and digital hardware
- 4006 Communications engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Brinson, L. C., Bekker, A. M., & Hwang, S. (1995). <title>Temperature-induced deformation in shape memory alloys</title>. In G. L. Anderson & D. C. Lagoudas (Eds.), SPIE Proceedings (Vol. 2427, pp. 234–244). SPIE. https://doi.org/10.1117/12.200920
Brinson, L Catherine, Alexander M. Bekker, and S. Hwang. “<title>Temperature-induced deformation in shape memory alloys</title>.” In SPIE Proceedings, edited by Gary L. Anderson and Dimitris C. Lagoudas, 2427:234–44. SPIE, 1995. https://doi.org/10.1117/12.200920.
Brinson LC, Bekker AM, Hwang S. <title>Temperature-induced deformation in shape memory alloys</title>. In: Anderson GL, Lagoudas DC, editors. SPIE Proceedings. SPIE; 1995. p. 234–44.
Brinson, L. Catherine, et al. “<title>Temperature-induced deformation in shape memory alloys</title>.” SPIE Proceedings, edited by Gary L. Anderson and Dimitris C. Lagoudas, vol. 2427, SPIE, 1995, pp. 234–44. Crossref, doi:10.1117/12.200920.
Brinson LC, Bekker AM, Hwang S. <title>Temperature-induced deformation in shape memory alloys</title>. In: Anderson GL, Lagoudas DC, editors. SPIE Proceedings. SPIE; 1995. p. 234–244.
Published In
SPIE Proceedings
DOI
ISSN
0277-786X
Publication Date
February 2, 1995
Volume
2427
Start / End Page
234 / 244
Publisher
SPIE
Conference Name
Symposium on Active Materials and Smart Structures: Society of Engineering Science 31st Annual Meeting
Related Subject Headings
- 5102 Atomic, molecular and optical physics
- 4009 Electronics, sensors and digital hardware
- 4006 Communications engineering