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Wafer bonding of diamond films to silicon for silicon-on-insulator technology

Publication ,  Journal Article
Yushin, GN; Wolter, SD; Kvit, AV; Collazo, R; Prater, JT; Stoner, BR; Sitar, Z
Published in: Materials Research Society Symposium Proceedings
January 1, 2002

Polycrystalline diamond films previously grown on silicon were polished to an RMS roughness of 15 nm and bonded to the silicon in a dedicated ultrahigh vacuum bonding chamber. Successful bonding under a uniaxial mechanical stress of 32 MPa was observed at temperatures as tow as 950°C. Scanning acoustic microscopy indicated complete bonding at fusion temperatures above 1150°C. Cross-sectional transmission electron microcopy later revealed a 30 nm thick intermediate amorphous layer consisting of silicon, carbon and oxygen.

Duke Scholars

Published In

Materials Research Society Symposium Proceedings

ISSN

0272-9172

Publication Date

January 1, 2002

Volume

686

Start / End Page

69 / 74
 

Citation

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Yushin, G. N., Wolter, S. D., Kvit, A. V., Collazo, R., Prater, J. T., Stoner, B. R., & Sitar, Z. (2002). Wafer bonding of diamond films to silicon for silicon-on-insulator technology. Materials Research Society Symposium Proceedings, 686, 69–74.
Yushin, G. N., S. D. Wolter, A. V. Kvit, R. Collazo, J. T. Prater, B. R. Stoner, and Z. Sitar. “Wafer bonding of diamond films to silicon for silicon-on-insulator technology.” Materials Research Society Symposium Proceedings 686 (January 1, 2002): 69–74.
Yushin GN, Wolter SD, Kvit AV, Collazo R, Prater JT, Stoner BR, et al. Wafer bonding of diamond films to silicon for silicon-on-insulator technology. Materials Research Society Symposium Proceedings. 2002 Jan 1;686:69–74.
Yushin, G. N., et al. “Wafer bonding of diamond films to silicon for silicon-on-insulator technology.” Materials Research Society Symposium Proceedings, vol. 686, Jan. 2002, pp. 69–74.
Yushin GN, Wolter SD, Kvit AV, Collazo R, Prater JT, Stoner BR, Sitar Z. Wafer bonding of diamond films to silicon for silicon-on-insulator technology. Materials Research Society Symposium Proceedings. 2002 Jan 1;686:69–74.

Published In

Materials Research Society Symposium Proceedings

ISSN

0272-9172

Publication Date

January 1, 2002

Volume

686

Start / End Page

69 / 74