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Selective Electroplating for 3D-Printed Electronics

Publication ,  Journal Article
Lazarus, N; Bedair, SS; Hawasli, SH; Kim, MJ; Wiley, BJ; Smith, GL
Published in: Advanced Materials Technologies
August 1, 2019

Creating 3D-printed parts with embedded circuitry is the next frontier in additive manufacturing, but printing of conductors with performance comparable to bulk metals such as copper is a difficult challenge. A hybrid process based on 3D printing followed by electroplating on highly conductive thermoplastic filament is used to manufacture 3D circuit boards and electronic packaging. Dual extruder heads on a standard fused filament fabrication printer are used to selectively define regions for electroplating, allowing distinct traces and multiple materials to be patterned in the same 3D-printed parts. Using this approach, a 3D-printed surface-mount package and a 555 timer oscillator circuit are demonstrated, including soldering of components onto the electroplated copper surface.

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Published In

Advanced Materials Technologies

DOI

EISSN

2365-709X

Publication Date

August 1, 2019

Volume

4

Issue

8

Related Subject Headings

  • 51 Physical sciences
  • 40 Engineering
  • 34 Chemical sciences
 

Citation

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Lazarus, N., Bedair, S. S., Hawasli, S. H., Kim, M. J., Wiley, B. J., & Smith, G. L. (2019). Selective Electroplating for 3D-Printed Electronics. Advanced Materials Technologies, 4(8). https://doi.org/10.1002/admt.201900126
Lazarus, N., S. S. Bedair, S. H. Hawasli, M. J. Kim, B. J. Wiley, and G. L. Smith. “Selective Electroplating for 3D-Printed Electronics.” Advanced Materials Technologies 4, no. 8 (August 1, 2019). https://doi.org/10.1002/admt.201900126.
Lazarus N, Bedair SS, Hawasli SH, Kim MJ, Wiley BJ, Smith GL. Selective Electroplating for 3D-Printed Electronics. Advanced Materials Technologies. 2019 Aug 1;4(8).
Lazarus, N., et al. “Selective Electroplating for 3D-Printed Electronics.” Advanced Materials Technologies, vol. 4, no. 8, Aug. 2019. Scopus, doi:10.1002/admt.201900126.
Lazarus N, Bedair SS, Hawasli SH, Kim MJ, Wiley BJ, Smith GL. Selective Electroplating for 3D-Printed Electronics. Advanced Materials Technologies. 2019 Aug 1;4(8).
Journal cover image

Published In

Advanced Materials Technologies

DOI

EISSN

2365-709X

Publication Date

August 1, 2019

Volume

4

Issue

8

Related Subject Headings

  • 51 Physical sciences
  • 40 Engineering
  • 34 Chemical sciences