Cooling of a heat-generating board inside a parallel-plate channel
This paper addresses the fundamental question of how to position a heat-generating board inside a parallel-plate channel, where it is cooled by forced convection. It is shown that when the board substrate is a relatively good thermal conductor, the best board position is near one of the channel walls, and the worst position is in the middle of the channel. The best and worst positions switch places when the board substrate is a relatively poor conductor. The optimal spacing between a heat-generating surface (uniform temperature, or uniform heat flux) and the insulated wall that completes a parallel-plate channel is reported. Finally, it is shown under what conditions it is advantageous to divide a heat-generating board into two or more equidistant boards inside the same channel, when the total rate of heat generation of all the boards and the channel spacing are fixed.
Duke Scholars
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DOI
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Related Subject Headings
- Mechanical Engineering & Transports
- 4012 Fluid mechanics and thermal engineering
- 0915 Interdisciplinary Engineering
- 0913 Mechanical Engineering
- 0901 Aerospace Engineering
Citation
Published In
DOI
Publication Date
Volume
Issue
Start / End Page
Related Subject Headings
- Mechanical Engineering & Transports
- 4012 Fluid mechanics and thermal engineering
- 0915 Interdisciplinary Engineering
- 0913 Mechanical Engineering
- 0901 Aerospace Engineering