Pulse Propagation on Multi-Layered Circuit-Level Interconnects
Publication
, Journal Article
Carin, L; Webb, KJ
Published in: Journal of Electromagnetic Waves and Applications
January 1, 1990
High-speed pulse propagation on terminated dual-level interconnects is investigated. The interconnects, modeled as multiconductor microstrip embedded in a layered dielectric substrate, are analyzed by using a full-wave approach to calculate dispersive eigencurrents, modal impedances, and mode speeds. The effects of dispersion on digital signal propagation are assessed upon comparison with results calculated using a frequency-independent TEM analysis. Termination effects are studied by investigating an example of five parallel running dual layered circuit level interconnects, with two lines on one plane and three on the other. © 1990, VSP. All rights reserved.
Duke Scholars
Published In
Journal of Electromagnetic Waves and Applications
DOI
EISSN
1569-3937
ISSN
0920-5071
Publication Date
January 1, 1990
Volume
4
Issue
3
Start / End Page
229 / 245
Related Subject Headings
- Networking & Telecommunications
- 4006 Communications engineering
- 0906 Electrical and Electronic Engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Carin, L., & Webb, K. J. (1990). Pulse Propagation on Multi-Layered Circuit-Level Interconnects. Journal of Electromagnetic Waves and Applications, 4(3), 229–245. https://doi.org/10.1163/156939390X00519
Carin, L., and K. J. Webb. “Pulse Propagation on Multi-Layered Circuit-Level Interconnects.” Journal of Electromagnetic Waves and Applications 4, no. 3 (January 1, 1990): 229–45. https://doi.org/10.1163/156939390X00519.
Carin L, Webb KJ. Pulse Propagation on Multi-Layered Circuit-Level Interconnects. Journal of Electromagnetic Waves and Applications. 1990 Jan 1;4(3):229–45.
Carin, L., and K. J. Webb. “Pulse Propagation on Multi-Layered Circuit-Level Interconnects.” Journal of Electromagnetic Waves and Applications, vol. 4, no. 3, Jan. 1990, pp. 229–45. Scopus, doi:10.1163/156939390X00519.
Carin L, Webb KJ. Pulse Propagation on Multi-Layered Circuit-Level Interconnects. Journal of Electromagnetic Waves and Applications. 1990 Jan 1;4(3):229–245.
Published In
Journal of Electromagnetic Waves and Applications
DOI
EISSN
1569-3937
ISSN
0920-5071
Publication Date
January 1, 1990
Volume
4
Issue
3
Start / End Page
229 / 245
Related Subject Headings
- Networking & Telecommunications
- 4006 Communications engineering
- 0906 Electrical and Electronic Engineering