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Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance

Publication ,  Journal Article
Glytsis, EN; Jokerst, NM; Villalaz, RA; Cho, SY; Wu, SD; Huang, Z; Brooke, MA; Gaylord, TK
Published in: Journal of Lightwave Technology
October 1, 2003

The performance of three optoelectronic structures incorporating substrate-embedded InP-based inverted metal-semiconductor-metal photodetectors and/or volume holographic gratings are analyzed and compared at the primary optical communication wavelengths. These structures, in conjunction with optical-quality polymer layers, can be easily integrated into silicon microelectronic substrates for the purpose of implementing potentially low-cost high-data-rate chip-level or substrate-level optical interconnects. The structures are as follows: a) an evanescent-coupling architecture with a sub-strate-embedded photodetector, b) a volume-holographic-grating coupler architecture with a substrate-embedded photodetector, and c) a volume-holographic-grating coupler architecture with a flip-chip-bonded photodetector. It is found that the primary characteristic of the evanescent coupling architectures is the efficient performance for both TE and TM polarizations with the disadvantage of exponentially decreasing efficiency with increasing separation between the waveguide film layer and the photodetector layer. On the other hand, the primary characteristic of the volume holographic grating architectures is the possibility of wavelength and polarization selectivity and their independence on the separation between the photodetector layer and the waveguide. Comparison of the analysis with experimental results is also included in the case of the evanescent coupling into a substrate-embedded photodetector.

Duke Scholars

Published In

Journal of Lightwave Technology

DOI

ISSN

0733-8724

Publication Date

October 1, 2003

Volume

21

Issue

10

Start / End Page

2382 / 2394

Related Subject Headings

  • Optoelectronics & Photonics
  • 5102 Atomic, molecular and optical physics
  • 4008 Electrical engineering
  • 4006 Communications engineering
  • 1005 Communications Technologies
  • 0906 Electrical and Electronic Engineering
  • 0205 Optical Physics
 

Citation

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Glytsis, E. N., Jokerst, N. M., Villalaz, R. A., Cho, S. Y., Wu, S. D., Huang, Z., … Gaylord, T. K. (2003). Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance. Journal of Lightwave Technology, 21(10), 2382–2394. https://doi.org/10.1109/JLT.2003.818178
Glytsis, E. N., N. M. Jokerst, R. A. Villalaz, S. Y. Cho, S. D. Wu, Z. Huang, M. A. Brooke, and T. K. Gaylord. “Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance.” Journal of Lightwave Technology 21, no. 10 (October 1, 2003): 2382–94. https://doi.org/10.1109/JLT.2003.818178.
Glytsis EN, Jokerst NM, Villalaz RA, Cho SY, Wu SD, Huang Z, et al. Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance. Journal of Lightwave Technology. 2003 Oct 1;21(10):2382–94.
Glytsis, E. N., et al. “Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance.” Journal of Lightwave Technology, vol. 21, no. 10, Oct. 2003, pp. 2382–94. Scopus, doi:10.1109/JLT.2003.818178.
Glytsis EN, Jokerst NM, Villalaz RA, Cho SY, Wu SD, Huang Z, Brooke MA, Gaylord TK. Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance. Journal of Lightwave Technology. 2003 Oct 1;21(10):2382–2394.
Journal cover image

Published In

Journal of Lightwave Technology

DOI

ISSN

0733-8724

Publication Date

October 1, 2003

Volume

21

Issue

10

Start / End Page

2382 / 2394

Related Subject Headings

  • Optoelectronics & Photonics
  • 5102 Atomic, molecular and optical physics
  • 4008 Electrical engineering
  • 4006 Communications engineering
  • 1005 Communications Technologies
  • 0906 Electrical and Electronic Engineering
  • 0205 Optical Physics