Electro-thermal resistance of GaAs interconnects
Publication
, Journal Article
Wartenberg, SA; Zhao, G; Liu, QH
Published in: Journal of Electronic Materials
January 1, 2005
This paper describes the effect of steady-state heating on the electrical and thermal resistance of interconnects on GaAs. Examined is a typical dual-layer metal interconnect system, common to GaAs processing. The interconnect system is considered in three parts, the interconnect metals, the Si3N4 dielectric surrounding the metal, and the Al xGa1-xAs epitaxial substrate. Using a meandering line as a test structure, measurements show how the direct current (DC) resistance increases with both temperature and dissipated power. Thermal resistors are proposed to account for self-heating and thermal coupling.
Published In
Journal of Electronic Materials
DOI
ISSN
0361-5235
Publication Date
January 1, 2005
Volume
34
Issue
3
Start / End Page
294 / 298
Related Subject Headings
- Applied Physics
- 51 Physical sciences
- 40 Engineering
- 34 Chemical sciences
- 1099 Other Technology
- 0906 Electrical and Electronic Engineering
- 0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics
Citation
APA
Chicago
ICMJE
MLA
NLM
Wartenberg, S. A., Zhao, G., & Liu, Q. H. (2005). Electro-thermal resistance of GaAs interconnects. Journal of Electronic Materials, 34(3), 294–298. https://doi.org/10.1007/s11664-005-0216-0
Wartenberg, S. A., G. Zhao, and Q. H. Liu. “Electro-thermal resistance of GaAs interconnects.” Journal of Electronic Materials 34, no. 3 (January 1, 2005): 294–98. https://doi.org/10.1007/s11664-005-0216-0.
Wartenberg SA, Zhao G, Liu QH. Electro-thermal resistance of GaAs interconnects. Journal of Electronic Materials. 2005 Jan 1;34(3):294–8.
Wartenberg, S. A., et al. “Electro-thermal resistance of GaAs interconnects.” Journal of Electronic Materials, vol. 34, no. 3, Jan. 2005, pp. 294–98. Scopus, doi:10.1007/s11664-005-0216-0.
Wartenberg SA, Zhao G, Liu QH. Electro-thermal resistance of GaAs interconnects. Journal of Electronic Materials. 2005 Jan 1;34(3):294–298.
Published In
Journal of Electronic Materials
DOI
ISSN
0361-5235
Publication Date
January 1, 2005
Volume
34
Issue
3
Start / End Page
294 / 298
Related Subject Headings
- Applied Physics
- 51 Physical sciences
- 40 Engineering
- 34 Chemical sciences
- 1099 Other Technology
- 0906 Electrical and Electronic Engineering
- 0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics