Skip to main content

Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener

Publication ,  Journal Article
Good, MS; Jr, RVH; Skorpik, JR; Pardini, AF; Smith, CM; Bowey, RE; Diaz, AA; Burghard, BJ; Judd, KM; Adamson, JD
Published in: Proceedings of SPIE - The International Society for Optical Engineering
2000

A laboratory system was developed that utilized an ultrasonic pulse-echo technique to detect very small cracks emanating from the thread root of a tensile-stressed fastener. Primary benefits were 1) the ability to inspect the fastener without its removal from the structure, 2) much improved detection sensitivity to small cracks, and 3) easy interpretation of data. The fastener of interest had threads with nominal inner and outer diameters of 1.8 cm (0.73 in.) and 2.2 cm (0.86 in.), respectively, and a thread pitch of 3.1 threads per centimeter (8.0 threads per in.). A plastic washer was placed over the fastener nut to shield the nut from ultrasound and thereby eliminate spurious signals. B-scan images provided feedback to align the ultrasonic scanner and fastener for optimal detection sensitivity. A tone-burst pulser-receiver controlled excitation frequency and bandwidth to maintain focal properties, minimize backscatter noise from the base material, and increase penetration into the coarse-grained Inconel. A custom ultrasonic transducer was used to optimize the focal properties over the inspection zone of 2.3 cm to 3.3 cm (0.9 in. to 1.3 in.) from the threaded end of the fastener. A calibration part with four 1.0-mm (0.040-in.) deep notches spanning the length of the inspection zone was used to calibrate distance-amplitude correction and system sensitivity. Custom B-scan and C-scan views were used to present data to the inspector and optimize the signal-to-noise ratio. A direct comparison was made between ultrasonic and destructive test images. Details of system hardware, data-acquisition procedure, analysis, and plans for a portable hand-held system for field inspection are provided.

Duke Scholars

Published In

Proceedings of SPIE - The International Society for Optical Engineering

Publication Date

2000

Volume

3995

Start / End Page

590 / 599

Related Subject Headings

  • 5102 Atomic, molecular and optical physics
  • 4009 Electronics, sensors and digital hardware
  • 4006 Communications engineering
 

Citation

APA
Chicago
ICMJE
MLA
NLM
Good, M. S., Jr, R. V. H., Skorpik, J. R., Pardini, A. F., Smith, C. M., Bowey, R. E., … Adamson, J. D. (2000). Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener. Proceedings of SPIE - The International Society for Optical Engineering, 3995, 590–599.
Good, M. S., R. V. H. Jr, J. R. Skorpik, A. F. Pardini, C. M. Smith, R. E. Bowey, A. A. Diaz, B. J. Burghard, K. M. Judd, and J. D. Adamson. “Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener.” Proceedings of SPIE - The International Society for Optical Engineering 3995 (2000): 590–99.
Good MS, Jr RVH, Skorpik JR, Pardini AF, Smith CM, Bowey RE, et al. Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener. Proceedings of SPIE - The International Society for Optical Engineering. 2000;3995:590–9.
Good, M. S., et al. “Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener.” Proceedings of SPIE - The International Society for Optical Engineering, vol. 3995, 2000, pp. 590–99.
Good MS, Jr RVH, Skorpik JR, Pardini AF, Smith CM, Bowey RE, Diaz AA, Burghard BJ, Judd KM, Adamson JD. Development of enhanced ultrasonic imaging for in situ inspection of a tension-stressed, threaded fastener. Proceedings of SPIE - The International Society for Optical Engineering. 2000;3995:590–599.

Published In

Proceedings of SPIE - The International Society for Optical Engineering

Publication Date

2000

Volume

3995

Start / End Page

590 / 599

Related Subject Headings

  • 5102 Atomic, molecular and optical physics
  • 4009 Electronics, sensors and digital hardware
  • 4006 Communications engineering