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Packaging consideration for 1 Gbps Si CMOS optical driver

Publication ,  Journal Article
Jung, S; Brooke, MA; Jokerst, NM
Published in: Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
December 1, 2000

A high speed laser driver circuit was designed and fabricated with an on-chip decoupling capacitor to prevent output distortion from packaging parasitics. The suitability of a decoupling capacitor with a minimum capacitance of 7 nF was verified.

Duke Scholars

Published In

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

ISSN

1092-8081

Publication Date

December 1, 2000

Volume

2

Start / End Page

882 / 883
 

Citation

APA
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ICMJE
MLA
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Jung, S., Brooke, M. A., & Jokerst, N. M. (2000). Packaging consideration for 1 Gbps Si CMOS optical driver. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, 2, 882–883.
Jung, S., M. A. Brooke, and N. M. Jokerst. “Packaging consideration for 1 Gbps Si CMOS optical driver.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS 2 (December 1, 2000): 882–83.
Jung S, Brooke MA, Jokerst NM. Packaging consideration for 1 Gbps Si CMOS optical driver. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 2000 Dec 1;2:882–3.
Jung, S., et al. “Packaging consideration for 1 Gbps Si CMOS optical driver.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, vol. 2, Dec. 2000, pp. 882–83.
Jung S, Brooke MA, Jokerst NM. Packaging consideration for 1 Gbps Si CMOS optical driver. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 2000 Dec 1;2:882–883.

Published In

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

ISSN

1092-8081

Publication Date

December 1, 2000

Volume

2

Start / End Page

882 / 883