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Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect

Publication ,  Journal Article
Brooke, M; Jokerst, NM; Bond, SW; Wills, DS
Published in: Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
December 1, 1998

High density interconnect (HDI) electrical interconnections and vertical optoelectronic (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon the Semiconductor Industry Association (SIA) Roadmap projections, which indicate interconnection as a challenge area for coming generations of electronics, optoelectronics may serve a role in chip to chip interconnections for massively parallel computational systems.

Duke Scholars

Published In

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

ISSN

1092-8081

Publication Date

December 1, 1998

Volume

2

Start / End Page

186 / 187
 

Citation

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Brooke, M., Jokerst, N. M., Bond, S. W., & Wills, D. S. (1998). Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, 2, 186–187.
Brooke, M., N. M. Jokerst, S. W. Bond, and D. S. Wills. “Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS 2 (December 1, 1998): 186–87.
Brooke M, Jokerst NM, Bond SW, Wills DS. Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 1998 Dec 1;2:186–7.
Brooke, M., et al. “Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect.” Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, vol. 2, Dec. 1998, pp. 186–87.
Brooke M, Jokerst NM, Bond SW, Wills DS. Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 1998 Dec 1;2:186–187.

Published In

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

ISSN

1092-8081

Publication Date

December 1, 1998

Volume

2

Start / End Page

186 / 187