Scholars@Duke

3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections

Publication ,  Journal Article
Bond, SW; Jung, S; Vendier, O; Brooke, MA; Jokerst, NM
Published in: LEOS Summer Topical Meeting
January 1, 1998

Three layers of standard foundry Si complimentary metal oxide semiconductor (CMOS) very large scale integrated (VLSI) integrated circuits, each integrated with long wavelength thin film emitter and detectors, have been stacked to realize a 3D system with optical interconnections between the layers. To demonstrate the vertical optical interconnections in the 3D smart pixel three layer Si CMOS circuit stack, the integrated transmitter and receiver circuit were tested. This system demonstrates the viability of implementing optical interconnections for scalable 3D interconnection systems for ultra-smart pixel applications.

Duke Scholars

Martin A. Brooke
Author Martin A. Brooke Electrical and Computer Engineering
Nan Marie Jokerst
Author Nan Marie Jokerst Electrical and Computer Engineering

Published In

LEOS Summer Topical Meeting

ISSN

1099-4742

Publication Date

January 1, 1998

Start / End Page

27 / 28
 

Citation

APA
Chicago
ICMJE
MLA
NLM
Bond, S. W., Jung, S., Vendier, O., Brooke, M. A., & Jokerst, N. M. (1998). 3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections. LEOS Summer Topical Meeting, 27–28.
Bond, S. W., S. Jung, O. Vendier, M. A. Brooke, and N. M. Jokerst. “3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections.” LEOS Summer Topical Meeting, January 1, 1998, 27–28.
Bond SW, Jung S, Vendier O, Brooke MA, Jokerst NM. 3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections. LEOS Summer Topical Meeting. 1998 Jan 1;27–8.
Bond, S. W., et al. “3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections.” LEOS Summer Topical Meeting, Jan. 1998, pp. 27–28.
Bond SW, Jung S, Vendier O, Brooke MA, Jokerst NM. 3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections. LEOS Summer Topical Meeting. 1998 Jan 1;27–28.

Published In

LEOS Summer Topical Meeting

ISSN

1099-4742

Publication Date

January 1, 1998

Start / End Page

27 / 28