ConferenceProceedings of the Electronic Packaging Technology Conference EPTC · October 13, 2014
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morp ...
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https://orcid.org/0000-0001-5123-1077