Scholarly Works - Journal articles
Journal article
Physical Review Applied
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December 1, 2025
We introduce a systematic approach for enhancing the absorbance of multilayer metamaterial absorbers (MMA) by combining deep-subwavelength spatially variable dielectric substrates with the increased Ohmic losses of MXene resonators. We choose MXenes to for ...
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Journal article
Matter
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November 5, 2025
The transition metal carbide (TMC) Ti3C2Tx features high conductivity, photothermal conversion, and flexibility, making it promising for light-driven soft actuators. However, conventional synthesis often results in fluorine ...
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Journal article
ACS nano
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October 2025
Characterization of atomic-scale materials traditionally requires human experts with months to years of specialized training. Even for trained human operators, accurate and reliable characterization remains challenging when examining newly discovered mater ...
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Journal article
Nano letters
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October 2025
The evolution of next-generation flexible, stretchable, and conformal microrobotics hinges significantly on advances in fabrication methods. There is a need to enhance the scalability of actuator feature dimensions and to increase the design versatility. T ...
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Journal article
ACS Applied Nano Materials
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November 8, 2024
In this work, we report the graphene-promoted formation of an interfacial oxide layer when certain metals are deposited on graphene. We probe interfacial oxide formation through the observation that several metals, when 10-12 nm in thickness and deposited ...
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Journal article
Journal of Vacuum Science and Technology A Vacuum Surfaces and Films
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December 1, 2023
Microwave loss in superconducting TiN films is attributed to two-level systems in various interfaces arising in part from oxidation and microfabrication-induced damage. Atomic layer etching (ALE) is an emerging subtractive fabrication method which is capab ...
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Journal article
Nature
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November 2023
Monolayer graphene with nanometre-scale pores, atomically thin thickness and remarkable mechanical properties provides wide-ranging opportunities for applications in ion and molecular separations1, energy storage2 and electronics ...
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Journal article
Journal of Vacuum Science and Technology A Vacuum Surfaces and Films
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May 1, 2023
We report the isotropic plasma atomic layer etching (ALE) of aluminum nitride using sequential exposures of SF6 plasma and trimethylaluminum [Al(CH3)3]. ALE was observed at temperatures greater than 200 °C, with a maximum etch rate of 1.9 Å/cycle observed ...
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Journal article
Matter
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August 3, 2022
Oxidation-resistant metallic films are of fundamental and practical interest in diverse applications, such as classical and quantum electronics. In a recent paper in Nature, Kim et al. report Cu (111) surfaces which do not oxidize over year timescales owin ...
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Journal article
Matter
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October 6, 2021
Bilayer graphene has attracted significant interest because of its unique properties, including fascinating electrical behavior when one layer is slightly rotated relative to the other. However, the quality of large-area bilayer graphene is often limited b ...
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Journal article
Matter
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May 5, 2021
Featured Publication
Performance challenges as electronics continue to scale down motivate searches for new interconnect materials. In a recent report in Matter, Lipatov and coworkers demonstrate that MXene may be a candidate for interconnects by measuring conductivity and bre ...
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Journal article
Nature communications
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February 2019
The performance and reliability of large-area graphene grown by chemical vapor deposition are often limited by the presence of wrinkles and the transfer-process-induced polymer residue. Here, we report a transfer approach using paraffin as a support layer, ...
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Journal article
ACS Photonics
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January 16, 2019
Graphene is a two-dimensional material with intriguing electrical and optical properties for infrared photonic devices. However, single layer graphene (SLG) suffers from a very low optical absorption of ∼1-2% depending on the substrate, which significantly ...
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Journal article
ACS nano
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March 2018
The reliability of lead-free Cu bonding technology is often limited by high bonding temperature and perpetual growth of intermetallic compounds between Sn solder and Cu substrate. Here, we report a low-bonding-temperature and highly reliable Cu bonding str ...
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Journal article
Applied Surface Science
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January 1, 2015
The evolution of interfacial morphology is investigated in joints bonded by a newly developed ambient-temperature ultrasonic bonding process based on Ni nano-cone arrays. This confirmed two types of void at the interface: a Type I void in the concave area ...
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Journal article
Journal of Electronic Materials
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November 1, 2014
Growth of intermetallic compounds (IMC) at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates have been investigated. For the Cu substrate, a Cu5Zn8 IMC layer with Ag3Sn particles on top was obse ...
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Journal article
Crystengcomm
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September 14, 2014
Featured Publication
Hierarchical mushroom-like cobalt materials were synthesized by galvanostatic electroplating. The morphology of the product, which can evolve from cone-like to mushroom-like nanostructures, is controllable by changing the deposition parameters. The nanostr ...
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