Martin A. Brooke

Journal article Science (New York, N.Y.) · April 2020 Ratcheting effects play an important role in systems ranging from mechanical socket wrenches to biological motor proteins. The underlying principle is to convert a fluctuating, unbiased force into unidirectional motion. Here, we report the ratcheting of el ... Full text Cite

Noninvasive material thickness detection by aerosol jet printed sensors enhanced through metallic carbon nanotube ink

Journal article IEEE Sensors Journal · July 15, 2017 Demand for cheaper and more functional sensors continues to rise in an era when data can be used to improve health, safety, and efficiency in daily lives. In this paper, we present a fully printed sensor capable of noninvasive material thickness detection. ... Full text Cite

Miniature spectral imaging device for wide-field quantitative functional imaging of the morphological landscape of breast tumor margins.

Journal article J Biomed Opt · February 1, 2017 We have developed a portable, breast margin assessment probe leveraging diffuse optical spectroscopy to quantify the morphological landscape of breast tumor margins during breast conserving surgery. The approach presented here leverages a custom-made 16-ch ... Full text Link to item Cite

A diffuse reflectance spectral imaging system for tumor margin assessment using custom annular photodiode arrays.

Journal article Biomed Opt Express · December 1, 2012 Diffuse reflectance spectroscopy (DRS) is a well-established method to quantitatively distinguish between benign and cancerous tissue for tumor margin assessment. Current multipixel DRS margin assessment tools are bulky fiber-based probes that have limited ... Full text Open Access Link to item Cite

Diffuse reflectance spectral imaging for breast tumor margin assessment

Journal article Progress in Biomedical Optics and Imaging Proceedings of SPIE · June 12, 2012 Diffuse reflectance spectroscopy has been previously explored as a promising method for providing real-time visual maps of tissue composition to help surgeons determine breast lumpectomy margins and to ensure the complete removal of a tumor during surgery. ... Full text Cite

A custom wide-field spectral imager for breast cancer margin assessment

Journal article IEEE Photonic Society 24th Annual Meeting Pho 2011 · December 1, 2011 A custom imaging array optimized for wide-field diffuse reflectance spectroscopy imaging for breast cancer margin diagnosis has been designed and implemented, with improvements over a previously reported system. © 2011 IEEE. ... Full text Cite

Custom annular photodetector arrays for breast cancer margin assessment using diffuse reflectance spectroscopy

Journal article 2011 IEEE Biomedical Circuits and Systems Conference Biocas 2011 · December 1, 2011 A custom imaging array has been optimized for diffuse reflectance spectroscopy for breast cancer margin assessment. The imaging array has been designed, fabricated and tested with a 99% diffuse reflectance standard, a 2% diffuse reflectance standard, bovin ... Full text Cite

Integrated sensing and information processing theme-based redesign of the undergraduate electrical and computer engineering curriculum at Duke University

Journal article Advances in Engineering Education · 2010 The field of electrical and computer engineering has evolved significantly in the past two decades. This evolution has broadened the field of ECE, and subfields have seen deep penetration into very specialized areas. Remarkable devices and systems arising ... Cite

Design of a flexible RF data link and associated laboratory curriculum in a first analog electronics and devices course

Journal article ASEE Annual Conference and Exposition, Conference Proceedings · September 1, 2009 A flexible low cost digital RF/IR communication link is described with an accompanying curriculum. The construction of the data link is intended to provide a jumping off point for students to explore electronics in a design-oriented, project-based first el ... Cite

Progress in chip-scale photonic sensing.

Journal article IEEE transactions on biomedical circuits and systems · August 2009 Chip-scale integrated planar photonic sensing systems for portable diagnostics and monitoring are emerging, as photonic components are integrated into systems with silicon (Si), Si complementary metal-oxide semiconductor, and fluidics. This paper reviews p ... Full text Cite

Multivariate calibration on a low transistor-count sensor signal processor

Journal article Midwest Symposium on Circuits and Systems · October 27, 2008 This paper presents the implementation of multivariate calibration, which is a Chemometrics technique, on a 16-bit precision, low transistor-count serial sensor signal processor. The primary advantage of the proposed processor is its small area consumption ... Full text Cite

Mixed-domain simulation of electrophoretic DNA separation for CMOS IC design

Journal article Midwest Symposium on Circuits and Systems · October 27, 2008 Electrophoretic separation is a key technology for DNA sequencing, environmental pathogen detection and identification, disease diagnostics, and proteomics. However, current electrophoresis systems are limited to laboratory benchtop applications due to cos ... Full text Cite

Chip scale integrated planar photonics

Journal article Proceedings of SPIE the International Society for Optical Engineering · April 23, 2008 The integration of planar optical components at the chip scale with electronic and microfluidic systems is enabling an increased penetration of optical functionality into systems, and in particular, into highly portable systems. Planar lightwave integrated ... Full text Cite

Chip-scale sensor system integration for portable health monitoring.

Journal article Anesthesia and analgesia · December 2007 The revolution in integrated circuits over the past 50 yr has produced inexpensive computing and communications systems that are powerful and portable. The technologies for these integrated chip-scale sensing systems, which will be miniature, lightweight, ... Full text Cite

General purpose serial processor for delta sigma ADC digital filter

Journal article Midwest Symposium on Circuits and Systems · December 1, 2007 Due to the single binary bitstream output nature of delta-sigma analog-to-digital converters, a compact serial processor that can perform general purpose computation as well as signal processing for the delta-sigma converter is proposed. The advantages of ... Full text Cite

Low voltage electrophoresis on a CMOS chip

Journal article Midwest Symposium on Circuits and Systems · December 1, 2007 Electrophoresis is a valuable technique for the separation and analysis of chemical and biological specimens. Typically, an electric field is established between two electrodes that induces charged particles to move and separate. Instead of using only one ... Full text Cite

Using neural net architectures in analog circuits

Journal article Midwest Symposium on Circuits and Systems · December 1, 2007 A method of using parallel analog building blocks with adjustable parameters was demonstrated to be able to achieve a wide array of analog circuit functionally with high accuracy. The method is generally useful when the penalty for needing to adapt the cir ... Full text Cite

Integrator bound-based nonlinear decoder for delta-sigma modulator

Journal article Midwest Symposium on Circuits and Systems · December 1, 2006 A new nonlinear iterative delta-sigma decoder based on the modulator integrator bounds is presented. The proposed decoder has faster convergence and more efficient decision levels than the previously known zoomer decoder. The proposed decoder shows the bes ... Full text Cite

CMOS digital pixel sensor with multiple reference, multiple sampling dynamic range enhancement

Journal article Midwest Symposium on Circuits and Systems · December 1, 2006 A CMOS DPS (Digital Pixel Sensor) with wide dynamic range is presented. Highly efficient exponential multiple sampling with variable reset voltage is used to enhance the dynamic range. Each pixel in the image sensor is composed of a photo detector, a compa ... Full text Cite

Scalable delta-sigma modulator readout architecture for array-based sensor system

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 2006 A scalable and modular delta-sigma modulator readout architecture and an implementation for an array-based sensor system are presented. The proposed readout system has parallel finite impulse response (FIR) filters that are one-to-one mapped to a large-sca ... Cite

A compact CPU architecture for sensor signal processing

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 2006 This paper proposes a compact, one-bit serial processing CPU architecture for general purpose computing as well as for digital signal processing. The primary design goal is to achieve optimal silicon area, which is one of the critical demands in the area-c ... Cite

Mixed-signal implementation of a nonlinear decoder for delta-sigma encoded stream

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 2006 A mixed-signal implementation of an iterative bound-based nonlinear data acquisition decoding algorithm for first-order delta-sigma (Δ-Sigma;) analog-to-digital converters (ADCs) is discussed. The design is partitioned into analog and digital sections whic ... Cite

Identifying the source of BW failures in high-frequency linear analog circuits based on S-parameter measurements

Journal article IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems · November 1, 2006 High-frequency linear analog circuits are widely used in high-speed and wireless radio frequency communication circuits as front-end devices. The small-signal model of transistors is typically used to evaluate the bandwidth (BW) of such devices during desi ... Full text Cite

Optoelectronic integration for planar lightwave systems in chip scale sensing, optical interconnect, and signal processing

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · January 1, 2006 Full text Cite

Ultra thin-film MSM photodetector with low parasitic capacitance

Journal article Proceedings of IEEE Sensors · January 1, 2006 Parasitic capacitance analysis of an ultra thin-film Metal-Semiconductor- Metal(MSM) photodetector(PD) having the lowest capacitance per unit surface area is reported in this paper. Through cladding layers removing process using etching, 50-60% decrease in ... Full text Cite

Time-interleaved switched-capacitor filter for reconfigurable triple-band delta-sigma converter

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 2005 A time-interleaved switched-capactior filter design for reconfigurable triple-band delta-sigma (δσ) analog-to-digital converter (ADC) is discussed. The proposed filter design utilizes time multiplexing of sampled data to capacitors, and it is useful to imp ... Full text Cite

Integrated mixed-signal optoelectronic system-on-a-chip sensor

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 2005 A mixed-signal optoelectronic system-on-a-chip sensor was integrated with embedded photodetector arrays and interferometric optical waveguides on a silicon (Si) complementary metal oxide semiconductor (CMOS) circuit chip. Photodetector (PD) arrays were fab ... Full text Cite

Rapid, predictive measurement-based modeling for high frequency interconnect on FR4 substrate

Journal article Proceedings Electronic Components and Technology Conference · September 19, 2005 In this paper, a predictive (scalable) measurement-based model for high frequency interconnects on low cost FR4 substrates is proposed and demonstrated. In our research, the interconnects are modeled with equivalent circuits of scalable building blocks usi ... Cite

Comparative high speed optical interconnections using thin film photodetectors embedded in polymer waveguides

Journal article Proceedings Electronic Components and Technology Conference · September 19, 2005 As data rates increase, optical interconnections at the boards and substrate levels become interesting alternatives for high performance interconnections [1, 2]. Optical interconnection using embedded thin film photodetectors (PDs) in polymer waveguides is ... Cite

Planar lightwave integrated circuits integrated with thin film active optoelectronic devices

Journal article Progress in Biomedical Optics and Imaging Proceedings of SPIE · July 21, 2005 The integration of active optoelectronic devices, passive optical devices, and electronics into planar lightwave integrated circuits (PLICs) at the chip level, and planar lightwave integrated systems (PLIS) at the substrate or package level, have applicati ... Full text Cite

High speed optical signal distribution using fully embedded thin film MSM photodetectors in multimode interference couplers

Journal article Proceedings of SPIE the International Society for Optical Engineering · July 21, 2005 High speed optical interconnections offer an attractive alternative to electrical interconnections, particularly when they can be integrated into electrical systems. In particular, waveguide signal distribution and optical to electrical (O/E) conversion ar ... Full text Cite

Integrated planar lightwave bio/chem OEIC sensors on Si CMOS circuits

Journal article Progress in Biomedical Optics and Imaging Proceedings of SPIE · July 21, 2005 Optical sensing, and the integration of sensors and electronics into Sensor on a Chip and Sensor on a Package systems are an approach to the creation of miniaturized, portable, customizable, low cost sensor systems for rapid health diagnostics, medical res ... Full text Cite

Heterogeneous integration of optical interconnects

Journal article Optics InfoBase Conference Papers · January 1, 2005 Optical interconnections at the board and chip levels are being integrated into traditional electrical interconnection systems using heterogeneous integration of thin film active optoelectronic devices (photodetectors, lasers) and passive waveguiding struc ... Cite

Organic planar lightwave integrated circuits for sensing and interconnections

Journal article Optics InfoBase Conference Papers · January 1, 2005 Polymer waveguides and optical structures such as microcavity sensors can be utilized in planar lightwave integrated circuits, which combine passive and active optical and/or electronic components in a planar format. © 2005 OSA. ... Cite

Integrated planar lightwave bio/chem OEIC sensors on Si CMOS circuits

Journal article Proc. SPIE - Int. Soc. Opt. Eng. (USA) · 2005 Optical sensing, and the integration of sensors and electronics into Sensor on a Chip and Sensor on a Package systems are an approach to the creation of miniaturized, portable, customizable, low cost sensor systems for rapid health diagnostics, medical res ... Cite

FR4 printed circuit board design for Giga-bits embedded optical interconnect applications

Journal article Proceedings Electronic Components and Technology Conference · December 27, 2004 As the demand of high data rate increases, electrical interconnects on the board becomes a bottleneck for the overall system performance because of crosstalk, transmission line effects, clock skew, and timing jitter. Thus, considerable effort has been made ... Cite

Data acquisition sensitivity determination of a sensor-on-a-chip integrated microsystem

Journal article Proceedings of IEEE Sensors · December 1, 2004 A sensor-on-a-chip integrated microsystem was implemented through a standard silicon (Si) complementary metal oxide semiconductor (CMOS) fabrication and an optical waveguide integration processes. The fabricated Si CMOS chip has embedded lateral pnp bipola ... Cite

Etch enhanced low capacitance, large area thin film InGaAs metal-semiconductor-metal photodetectors

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 2004 The enhancement of the impulse response and capacitance performance of thin film InGaAs metal-semiconductor-metal (MSM) was carried out through etching. The capacitances of the MSM were measured using scattering parameter measurements using a lightwave com ... Cite

A 10 Gbit/s Si CMOS transimpedance amplifier with an integrated MSM photodetector for optical interconnections

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 2004 A wideband preamplifier was designed and fabricated using a 0.18 μm CMOS technology. The amplifier was heterogeneously integrated with a thin film InGaAs inverted photodetector. A successful demonstration at a bit rate of 10 Gbps was reported. All the stag ... Cite

Wideband multiple resonance small-signal laser diode model for the co-design of laser drive circuits

Journal article Midwest Symposium on Circuits and Systems · December 1, 2004 A wideband multiple resonance small-signal laser equivalent circuit model is presented to improve optoelectronic circuit design accuracy. Two important laser diode characteristics, such as input reflections and electrical-to-optical transmissions are expre ... Cite

Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices

Journal article Journal of Lightwave Technology · September 1, 2004 Optical interconnection and signal distribution at the backplane, board, and substrate level can be implemented using thin-film active optoelectronic devices embedded in polymer waveguide structures. These active embedded devices eliminate the need for opt ... Full text Cite

Improved measurement-based modeling of inverted-MSM photodetectors using on-wafer calibration structures

Journal article Proceedings of SPIE the International Society for Optical Engineering · August 16, 2004 Photodetectors (PDs) are an important active device in optoelectronic integrated circuits (OEICs), and, for shorter haul interconnections where circuit (e.g. transimpedance amplifier (TIA)) noise may be the dominant noise in receivers, metal-semiconductor- ... Full text Cite

High speed optical interconnections using thin film PDs embedded in polymer waveguides on electrical boards

Journal article Proceedings of SPIE the International Society for Optical Engineering · August 16, 2004 As an alternative approach to current electrical interconnection technology, optical interconnections at high speeds offer several potential advantages including small footprint, simple system design (in comparison to transmission lines), and immunity to e ... Full text Cite

Integration of Si-CMOS embedded photo detector array and mixed signal processing system with embedded optical waveguide input

Journal article Proceedings of SPIE the International Society for Optical Engineering · August 16, 2004 Arrays of embedded bipolar junction transistor (BJT) photo detectors (PD) and a parallel mixed-signal processing system were fabricated as a silicon complementary metal oxide semiconductor (Si-CMOS) circuit for the integration optical sensors on the surfac ... Full text Cite

High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors

Journal article IEEE Journal on Selected Topics in Quantum Electronics · July 1, 2004 Inverted metal-semiconductor-metal (I-MSM) photodetectors, which are thin-film MSMs with the growth substrate removed and fingers on the bottom of the device (to eliminate finger shadowing to enhance responsivity), are reported herein for high-speed high-e ... Full text Cite

Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution

Journal article IEEE Transactions on Advanced Packaging · May 1, 2004 As the data rate of integrated circuits dramatically increases, interconnection speed at the backplane and board levels are beginning to limit system performance, which drives investigations into alternative interconnection technologies. Critical factors t ... Full text Cite

InGaAs MSM Photodetectors Modeling Using DOE Analysis

Journal article Proceedings of SPIE - The International Society for Optical Engineering · 2004 Linear statistical models have been generated to predict the performance of metal-semiconductor-metal (MSM) PDs for multi-gigabit optical interconnections. The models estimate the bandwidth and responsivity of the MSM PDs based on the input factors: absorb ... Full text Link to item Cite

Parasitic modeling and analysis for a 1-Gb/s CMOS laser driver

Journal article IEEE Transactions on Circuits and Systems II: Express Briefs · 2004 A differential laser driver (LD) operating at 1 Gb/s been designed and tested using NSC 0.35-μm CMOS technology. The effect of simultaneous switching noise caused by packaging parasitic was addressed and the parasitic model was developed to predict the ... Full text Link to item Cite

An interferometric sensor for integration with Si CMOS signal processing circuitry: "Sensor on a Chip"

Journal article OSA Trends in Optics and Photonics Series · January 1, 2004 A scheme for integrating interferometric sensors with Si CMOS circuitry is presented. An integrated biological\chemical sensor provides a low cost, noninvasive alternative to traditional sensor technologies. ... Cite

Diagnosis of small-signal parameters for broadband amplifiers through S-parameter measurements and sensitivity-guided evolutionary search

Journal article IEEE ACM International Conference on Computer Aided Design Digest of Technical Papers Iccad · January 1, 2004 With increasing uncertainties in the modeling and processing of semiconductor devices, it is essential that the sources of failures be identified once the devices are manufactured. In this paper, we present a methodology to diagnose the problems in broad-b ... Cite

Optical chip-to-chip interconnects for memory systems

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 9, 2003 Optical interconnections offer a simple way to design and implement alternatives to point to point electrical interconnections. In fact, the design complexity of these optical interconnections is similar to lower speed multi-drop electrical interconnection ... Cite

An Experimental Evaluation of Error Spectrum Shaping Applied to Mixed-Signal Image Convolutions

Journal article IEEE Transactions on Circuits and Systems II Analog and Digital Signal Processing · December 1, 2003 In this experimental research paper, analog circuits are manufactured and their performance evaluated for suitability in performing FIR image filtering with the convolution kernel and data altered via error spectrum shaping and oversampling so as to preclu ... Full text Cite

Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance

Journal article Journal of Lightwave Technology · October 1, 2003 The performance of three optoelectronic structures incorporating substrate-embedded InP-based inverted metal-semiconductor-metal photodetectors and/or volume holographic gratings are analyzed and compared at the primary optical communication wavelengths. T ... Full text Cite

High speed optical interconnection using embedded PDs on electrical boards

Journal article Proceedings Electronic Components and Technology Conference · July 17, 2003 An integration process for creating optical interconnections which can be integrated in a post-processing format onto standard boards and modules, and eventually, even integrated circuits is presented. The process is consistent with integration onto electr ... Cite

Comparison of electrical and optical interconnect

Journal article Proceedings Electronic Components and Technology Conference · July 17, 2003 Electrical and optical interconnects were compared to evaluate superiority of data rate, channel power dissipation and power consumption in driver as a function of line length. Transmission lines were simulated by HSPICE transient simulator and measured fo ... Cite

Test-structure free modeling method for de-embedding the effects of pads on device modeling

Journal article Proceedings Electronic Components and Technology Conference · July 17, 2003 On-wafer measurements of devices always include the parasitic effects of probe pads, interconnections, and substrate resistance. In order to extract actual Device Under Test (DUT) parameters from the measurements, several on-wafer test structures such as o ... Cite

A 1.4 G samples/sec comb filter design for decimation of sigma-delta modulator output

Journal article Proceedings IEEE International Symposium on Circuits and Systems · July 14, 2003 A new architecture of high-speed comb filter is proposed and simulated. The proposed architecture takes advantage of the concept of carry-save adder and binary signed-digit to minimizes the carry propagation. It has a highly modular architecture and can be ... Cite

Optical interconnections on electrical boards using embedded active optoelectronic components

Journal article IEEE Journal on Selected Topics in Quantum Electronics · March 1, 2003 Significant opportunities are emerging for optical interconnections at the board, module, and chip level if compact, low loss, high data rate optical interconnections can be integrated into these electrical interconnection systems. This paper describes an ... Full text Cite

The heterogeneous integration of optical interconnections into integrated microsystems

Journal article IEEE Journal on Selected Topics in Quantum Electronics · March 1, 2003 Emerging techniques for integrating optoelectronic (OE) devices, analog interface circuitry, RF circuitry, and digital logic into ultra-mixed signal systems offers approaches toward and demonstrations of integrated optical interconnections in electrical mi ... Full text Cite

Optoelectronic Microsystems Integration

Journal article Optics and Photonics News · January 1, 2003 The methods used in integration and processing of optical functions into an electronic system are discussed. Planar lightwave circuit interconnections at the board, module and chip level are being used for optical connections at very short distances. The i ... Full text Cite

Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits

Journal article IEEE Journal on Selected Topics in Quantum Electronics · November 1, 2002 Significant opportunities exist for optical interconnections at the board, module, and chip level if compact, low-loss, high-data-rate optical interconnections can be integrated into these electrical interconnection systems. To create such an integrated op ... Full text Cite

The heterogeneous integration of GaN thin-film metal-semiconductor-metal photodetectors onto silicon

Journal article IEEE Photonics Technology Letters · February 1, 2002 The heterogeneous integration of GaN thin-film metal-semiconductor-metal (MSM) photodetectors onto a host substrate of SiO2-Si is reported herein. Thin-film GaN photodetectors were separated from the lithium gallate (LiGaO2) growth su ... Full text Cite

A CMOS feedforward neural-network chip with on-chip parallel learning for oscillation cancellation.

Journal article IEEE transactions on neural networks · January 2002 The paper presents a mixed signal CMOS feedforward neural-network chip with on-chip error-reduction hardware for real-time adaptation. The chip has compact on-chip weighs capable of high-speed parallel learning; the implemented learning algorithm is a gene ... Full text Cite

Stacked thin film InGaAs and GaAs photodetectors for fully registered wavelength discrimination

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · January 1, 2002 The fabrication and characterization of co-located, 3D stacked thin film PDs was carried out. Independent electrical access to each of the two spatially co-located photodetectors was demonstrated, with two different wavelengths successfully resolved. ... Cite

Comparison of evanescent and directly coupled optical interconnections embedded into electronic interconnection substrates

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · January 1, 2002 An overview is given of the fabrication process technology and measurement results for two different embedded structures: thin film InGaAs photodetectors embedded in a polymer waveguide and below a polymer waveguide, with both exhibiting efficient coupling ... Cite

Polymer waveguide optical interconnections on Si CMOS circuits

Journal article Pacific Rim Conference on Lasers and Electro Optics CLEO Technical Digest · January 1, 2002 Optical interconnections, on foundry silicon complementary metal oxide semiconductors (CMOS) circuits using polymer optical waveguides, was demonstrated. The polymer optical waveguides were directly fabricated on two Si CMOS circuits. The channel in the fa ... Cite

Thin film GaN metal-semiconductor-metal photodetectors integrated onto silicon

Journal article Pacific Rim Conference on Lasers and Electro Optics CLEO Technical Digest · January 1, 2002 The metal-semiconductor-metal (MSM) photodetector dark current and responsivity results for the growth of gallium nitride on lithium gallate substrates were reported. The heterogeneous integration of thin film gallium nitride MSM detectors onto host substr ... Cite

An enhancement study on the SDSL upstream receiver

Journal article Iscas 2001 2001 IEEE International Symposium on Circuits and Systems Conference Proceedings · December 1, 2001 This paper provides a new approach to mitigate the crosstalk interference in the symmetric digital subscriber line (SDSL) upstream transmission. A vector channel equalizer has been proposed for the SDSL upstream receiver to enhance spectral compatibility f ... Full text Cite

An enhancement study on the SDSL upstream receiver

Journal article Materials Research Society Symposium Proceedings · January 1, 2001 This paper provides a new approach to mitigate the crosstalk interference in the symmetric digital subscriber line (SDSL) upstream transmission. A vector channel equalizer has been proposed for the SDSL upstream receiver to enhance spectral compatibility f ... Cite

Statistical modeling of 3-D parallel-plate embedded capacitors using Monte Carlo simulation

Journal article ETRI Journal · January 1, 2001 Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded pl ... Full text Cite

Heterogeneous integration: From substrate technology to active packaging

Journal article Technical Digest International Electron Devices Meeting · January 1, 2001 Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced pack ... Full text Cite

Mitigation of crosstalk on the SDSL upstream transmission with vector equalization

Journal article IEEE International Conference on Communications · January 1, 2001 This paper provides a new approach to mitigate the crosstalk interference in the symmetric digital subscriber line (SDSL) upstream transmission. A vector channel equalizer has been proposed for the SDSL upstream receiver to enhance spectral compatibility f ... Cite

Highly alignment tolerant InGaAs inverted MSM photodetector heterogeneously integrated on a differential Si CMOS receiver operating at 1 Gbps

Journal article Proceedings Electronic Components and Technology Conference · January 1, 2001 The increasing demand for high bandwidth, low latency I/O in gigascale systems is challenging current packaging technology. Optoelectronic I/O offers needed performance, but presents new challenges in mixed signal (digital, analog, optical, RF) design and ... Full text Cite

A study on multiuser DSL channel capacity with crosstalk environment

Journal article IEEE Pacific RIM Conference on Communications Computers and Signal Processing Proceedings · January 1, 2001 This paper describes a new approach to enhance Digital Subscriber Line (DSL) (emphasizing DMT-ADSL) throughput with multiuser channel model. We have studied the spectral distribution of DSL interference and the capacity of a twisted pair channel in a same ... Cite

Smart photonics: Optoelectronics integrated with Si CMOS VLSI circuits

Journal article Proceedings of SPIE the International Society for Optical Engineering · December 1, 2000 Smart photonics, the integration of optoelectronic devices with electronic circuits and systems, has growing applications in many fields, one of which is computing. An exploration of the opportunities, integration technologies, and some recent results usin ... Cite

Alignment tolerant InP/Si CMOS hybrid integrated photoreceivers operating at 0.9 Gbps

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 2000 An overview is given on the hybrid integration of a thin film large area, low capacitance InGaAsP/InP inverted metal-semiconductor-metal photodetector onto a Si CMOS differential receiver circuit. The integrated receiver has a measured bit-error-rate (BER) ... Cite

Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates

Journal article Proceedings Electronic Components and Technology Conference · December 1, 2000 High frequency signal distribution in HDI/HDW substrates can be achieved using optical interconnections. To realize effective milli- and micro-haul interconnections on these substrates, the hybrid integration of independently optimized interface circuits a ... Cite

Modulator design for smart pixel multispectral imaging arrays

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 2000 Multispectral imagers have been heavily studied for their application to target recognition, industrial gas pollutant monitoring, and biomedical imaging. This article describes the design and simulation of a 0.25 micron CMOS modulator and small enough to a ... Cite

Packaging consideration for 1 Gbps Si CMOS optical driver

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 2000 A high speed laser driver circuit was designed and fabricated with an on-chip decoupling capacitor to prevent output distortion from packaging parasitics. The suitability of a decoupling capacitor with a minimum capacitance of 7 nF was verified. ... Cite

Statistical analysis of embedded capacitors using Monte Carlo simulation

Journal article Proceedings Electronic Components and Technology Conference · December 1, 2000 A method of accurately modeling new passive devices by deembedding the many building blocks is described. It is shown that the variation in the complete equivalent circuit models can be used to predict variations in actual fabricated devices. ... Cite

Bidirectional single fiber low-cost optoelectronic interconnect for automotive applications

Journal article IEEE Transactions on Vehicular Technology · January 1, 2000 Current trends in vehicular technology reflect an increase in the number of electronic modules, leading to more complicated and expensive wiring. The use of optic fibers offers a low-cost alternative to traditional copper-wire harnesses. This paper present ... Full text Cite

Hybrid optically interconnected microprocessor: An InP I-MSM integrated onto a mixed signal CMOS analog optical receiver with a digital CMOS microprocessor

Journal article Proceedings of SPIE the International Society for Optical Engineering · January 1, 2000 This paper presents the results of simultaneously working fully-differential optoelectronic (OE) receiver fabricated in Si CMOS with digital SIMD microprocessor on the same die next to analog, optical interface circuitry, the receiver have been hybrid inte ... Cite

Microsystem Optoelectronic Integration for Mixed Multisignal Systems

Journal article IEEE Journal on Selected Topics in Quantum Electronics · January 1, 2000 The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent resul ... Full text Cite

Building collaborative teams for multi-disciplinary educational projects in optoelectronics

Journal article Proceedings of SPIE the International Society for Optical Engineering · January 1, 2000 Multidisciplinary team-oriented research is an effective method for investigating systems spanning multiple knowledge areas. Building on cross-functional team strategies developed for highly competitive industries, experts from a variety of technical domai ... Full text Cite

Extraction of passive device model parameters using genetic algorithms

Journal article ETRI Journal · January 1, 2000 The extraction of model parameters for embedded passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, a method for optimizing the extraction of these parameters using genetic alg ... Full text Cite

Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits

Journal article LEOS Summer Topical Meeting · January 1, 2000 A 'smart' multispectral imaging system that can be fabricated with independently optimized detector arrays and Si CMOS circuits is described. This imager utilizes the heterogeneous integration of thin film GaN (UV), MCT (MWIR), and Si CMOS circuitry to cre ... Full text Cite

Enhanced imaging arrays using a sigma delta ADC in Si CMOS for each array pixel

Journal article LEOS Summer Topical Meeting · January 1, 2000 Recently we have demonstrated a compact current input oversampling modulator for a scalable high frame rate focal plane arrays that enable frame rates over than 100kfps operating in continuous imaging mode. All the circuits including data lines and detecto ... Cite

Alignment tolerant hybrid photoreceivers using inverted MSMs

Journal article LEOS Summer Topical Meeting · January 1, 2000 A thin film large area, low capacitance, high responsivity InGaAs/InP inverted metal-semiconductor-metal (I-MSM) was hybrid integrated onto a Si CMOS differential receiver circuit. The integrated receiver demonstrated a bit-error-rate (BER) of 10-11 Cite

Clock extraction circuit using passive components-free filter in standard digital process

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 2000 The necessity of passive components in analog circuit design such as Clock Recovery Circuits (CRC) or Phase Locked Loops (PLL) has been a main barrier to overcome especially when using a standard digital CMOS process. In addition to lack of support of high ... Full text Cite

Compact current input oversampling modulator design for a scalable high frame rate focal plane arrays

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 2000 This paper demonstrates a compact current input oversampling modulator for a scalable high frame rate focal plane arrays. This smart pixel architecture with the proposed compact current input oversampling modulator is intended for scientific imagers with f ... Full text Cite

Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer ltcc process

Journal article IEEE Transactions on Advanced Packaging · December 1, 1999 A novel technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process. The method is empirical in nature and ... Full text Cite

Using multivariate nested distributions to model semiconductor manufacturing processes

Journal article IEEE Transactions on Semiconductor Manufacturing · December 1, 1999 This paper demonstrates the advantages of modeling semiconductor process variability using a multivariate nested distribution. This distribution allows estimation not only of correlation among various model parameters, but also allows each of those variati ... Full text Cite

Smart photonics: Optoelectronics integrated onto Si CMOS circuits

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1999 Smart photonics, or the integration of optoelectronic (OE) devices and links with circuitry such as Si complementary metal oxide semiconductor (CMOS) very large scale integrated (VLSI) circuits, can yield both advanced optical links and possibly integrated ... Cite

RTD/CMOS Nanoelectronic Circuits: Thin-Film InP-Based Resonant Tunneling Diodes Integrated with CMOS Circuits

Journal article IEEE Electron Device Letters · March 1, 1999 The combination of resonant tunneling diodes (RTD's) and complementary metal-oxide-semiconductor (CMOS) silicon circuitry can offer substantial improvement in speed, power dissipation, and circuit complexity over CMOS-only circuits. We demonstrate the firs ... Full text Cite

Three-layer 3-D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks

Journal article IEEE Journal on Selected Topics in Quantum Electronics · March 1, 1999 We present for the first time a three-dimensional (3-D) Si CMOS interconnection system consisting of three layers of optically interconnected hybrid integrated Si CMOS transceivers. The transceivers were fabricated using 0.8-μm digital Si CMOS foundry circ ... Full text Cite

Smart CMOS focal plane arrays: A Si CMOS detector array and sigma-delta analog-to-digital converter imaging system

Journal article IEEE Journal on Selected Topics in Quantum Electronics · March 1, 1999 This paper evaluates the potential for the real-time utilization of high frame rate image sequences using a fully parallel readout system. Multiple readout architectures for high frame rate imaging are compared. The application domain for a fully parallel ... Full text Cite

Passive device modeling methodology using nonlinear optimization

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1999 In this paper we describe a method of accurately modeling new passive devices by deembedding the many building blocks from which they are built from just a few test structures. We use a nonlinear optimizer to find the optimal models for the building blocks ... Cite

Fully parallel learning neural network chip for real-time control

Journal article Proceedings of the International Joint Conference on Neural Networks · January 1, 1999 Presented in this paper is a parallel learning neural network chip, which is used to perform real-time output feedback control on a nonlinear dynamic plant. The controlled plant is a simulated unstable combustion process. Neural networks provide an adaptiv ... Cite

Adaptive digital bias control for an optical receiver and transmitter

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1999 This paper presents test results for an adaptive bias control for an optical receiver and transmitter. The need for accurate adaptive bias sources has been an important issue for the design of compact, high-resolution, high-precision optoelectronic circuit ... Cite

Fully parallel on-chip learning hardware neural network for real-time control

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1999 A parallel hardware neural network with on-chip learning ability is presented. The chip is used to perform real-time output feedback control on a nonlinear dynamic system. The non linear plant is a simulated unstable combustion process and is nonlinear eno ... Cite

Fully differential current-input CMOS amplifier front-end suppressing mixed signal substrate noise for optoelectronic applications

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1999 This work focuses on reducing substrate noise and substrate coupling using a fully differential circuit topology. Described is a current-mode optical receiver and comparator designed to reduce the digital substrate noise injection. ... Cite

A fast on-line neural-network training algorithm for a rectifier regulator

Journal article IEEE Transactions on Power Electronics · December 1, 1998 This paper addresses the problem of deadbeat control in fully controlled high-power-factor rectifiers. Improved deadbeat control can be achieved through the use of neural-network-based predictors for the input-current reference to the rectifier. In this ap ... Full text Cite

IRIS: An integrated, scalable focal plane architecture

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1998 Wearable video processing systems integrate low cost silicon detectors and analog interface circuitry with massively parallel digital processing on a single chip. While this `imaging system on a chip' can enable many significant new systems, many architect ... Cite

Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1998 High density interconnect (HDI) electrical interconnections and vertical optoelectronic (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon the S ... Cite

Accurate, rapid, high frequency empirically based predictive modeling of arbitrary geometry planar resistive passive devices

Journal article IEEE Transactions on Components Packaging and Manufacturing Technology Part B · May 1, 1998 A novel technique is presented for the high speed, accurate, predictive modeling of arbitrary geometry integrated resistor structures manufactured in a variety of technologies, including those of both multichip modules (MCM's) and integrated circuits (IC's ... Full text Cite

Stacked silicon CMOS circuits with a 40-Mb/s through-silicon optical interconnect

Journal article IEEE Photonics Technology Letters · April 1, 1998 Optical interconnection through stacked silicon foundry complementary metal-oxide-semiconductor (CMOS) circuitry has been demonstrated at a data rate of over 40 Mb/s with an open eye diagram. The system consists of a 0.8-μm transmitter and receiver realize ... Cite

Stacked silicon CMOS circuits with a 40-Mb/s through-silicon optical interconnect

Journal article IEEE Photonics Technology Letters · March 1, 1998 Optical interconnection through stacked silicon foundry complementary metal-oxide-semiconductor (CMOS) circuitry has been demonstrated at a data rate of over 40 Mb/s with an open eye diagram. The system consists of a 0.8-μm transmitter and receiver realize ... Cite

Review of RF packaging research at Georgia Tech's PRC

Journal article Proceedings 4th International Symposium on Advanced Packaging Materials Processes Properties and Interfaces · January 1, 1998 Consistent with the Packaging Research Center's vision of low cost single level integrated modules (SLIM), the Wireless Thrust is focused on developing integrated solutions for wireless interfaces. The core focus is to develop: (1) Development and analysis ... Full text Cite

High speed, smart focal plane processing using integrated photodetectors and Si CMOS VLSI sigma delta analog to digital converters

Journal article LEOS Summer Topical Meeting · January 1, 1998 A high frame rate smart pixel imaging system using an analog to digital converter per pixel in an 8×8 integrated detector array is discussed. The smart pixel architecture enables frame rates of up to 100 kfps operating in a continuous imaging mode. This in ... Cite

Integrated 1.55 μm receivers using GaAs MMICs and thin film InP detectors

Journal article IEEE MTT S International Microwave Symposium Digest · January 1, 1998 A GaAs-based amplifier has been designed and integrated with a large area, high efficiency, thin film InP-based metal-semiconductor-metal photodetector. Thin film integration is a hybrid integration scheme that minimizes the parasitics between the InP dete ... Cite

3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections

Journal article LEOS Summer Topical Meeting · January 1, 1998 Three layers of standard foundry Si complimentary metal oxide semiconductor (CMOS) very large scale integrated (VLSI) integrated circuits, each integrated with long wavelength thin film emitter and detectors, have been stacked to realize a 3D system with o ... Cite

Integrated 1.55 μm receivers using GaAs MMICs and thin film InP detectors

Journal article IEEE Radio Frequency Integrated Circuits Symposium RFIC Digest of Technical Papers · January 1, 1998 A GaAs-based amplifier has been designed and integrated with a large area, high efficiency, thin film InP-based metal-semiconductor-metal photodetector. Thin film integration is a hybrid integration scheme that minimizes the parasitics between the InP dete ... Cite

Statistically based parametric yield prediction for integrated circuits

Journal article IEEE Transactions on Semiconductor Manufacturing · December 1, 1997 This paper presents a novel procedure for predicting integrated circuit parametric performance and yield when provided with sample transistor test results and a circuit schematic. Two enhancements to the existing Monte Carlo simulation procedures are descr ... Full text Cite

Identification and control of induction motor stator currents using fast on-line random training of a neural network

Journal article IEEE Transactions on Industry Applications · December 1, 1997 Artificial neural networks (ANN's), which have no off-line pretraining, can be trained continually on-line to identify an inverter-fed induction motor and control its stator currents. Due to the small time constants of the motor circuits, the time to compl ... Full text Cite

Improvement in bit-error rate for optoelectronic multicomputer interconnection networks using cyclic redundancy code error detection

Journal article IEEE Photonics Technology Letters · June 1, 1997 This letter presents testing results of an integrated optoelectronic (OE) channel employing hop-by-hop error control circuitry based on cyclic redundancy codes (CRC) to improve the effective bit-error rate (BER). The use of OE interconnect in place of wire ... Full text Cite

A 100 Mbps, LED through-wafer optoelectronic link for multicomputer interconnection networks

Journal article Journal of Parallel and Distributed Computing · February 25, 1997 Through-wafer optoelectronic interconnect offers some architectural alternatives that are not available with wire-based interconnects. In order to compete with wire-based technologies, optoelectronic interconnects must provide reasonable performance in ter ... Full text Cite

Scaleable CMOS Current-Mode Preamplifier Design for an Optical Receiver

Journal article Analog Integrated Circuits and Signal Processing · January 1, 1997 We have designed a process-insensitive preamplifier for an optical receiver, fabricated it in several different minimum feature sizes of standard digital CMOS, and demonstrated design scaleability of this analog integrated circuit design. The same amplifie ... Full text Cite

Application of massively parallel processors to real time processing of high speed images

Journal article International Conference on Massively Parallel Processing Using Optical Interconnections MPPOI Proceedings · January 1, 1997 This paper demonstrates that the real-time utilization of image sequences, at flame rates far above what is currently possible, can now be achieved with an optically interconnected massively parallel processor. A focal plane processing chip with an on-chip ... Cite

Coupling efficiency of an alignment-tolerant, single fiber, bi-directional link

Journal article Proceedings Electronic Components and Technology Conference · January 1, 1997 In this paper, we present a novel Fourier technique to calculate the emitter-to-fiber coupling efficiency between an incoherent source of arbitrary directivity and a multimode fiber. The technique expresses the 4-D integral that describes the coupling as a ... Cite

Systolic processing architectures using optoelectronic interconnects

Journal article International Conference on Massively Parallel Processing Using Optical Interconnections MPPOI Proceedings · January 1, 1997 Systolic arrays have traditionally provided efficient, high performance execution for computation intensive applications. Despite the extensive research in systolic arrays, system designers must continually incorporate new technological advances to improve ... Cite

High speed on-line neural network control of an induction motor immune to analog circuit nonidealities

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1997 A neural network using the Random Weight Change algorithm is shown able to be trained to perform on-line control of the current of an induction motor stator, despite analog circuit nonidealities. The induction motor is a complex nonlinear electromechanical ... Cite

Accurate, high speed modeling of integrated passive devices in multichip modules

Journal article IEEE Topical Meeting on Electrical Performance of Electronic Packaging · December 1, 1996 A new method for the predictive modeling of passive devices with interactions based upon measurement and primitive cell characterization is presented. Building block RLC equivalents can be utilized for arbitrary geometry device modeling in high speed circu ... Cite

SIMPil: An OE integrated SIMD architecture for focal plane processing applications

Journal article International Conference on Massively Parallel Processing Using Optical Interconnections MPPOI Proceedings · December 1, 1996 Focal plane processing applications present a growing computing need for portable telecomputing and videoputing systems. This paper demonstrates the integration of digital processing, analog interface circuitry, and thin film OE devices into a compact comp ... Cite

8×8 array of resonant cavity enhanced light emitting diodes integrated onto silicon grayscale (32 level) driver circuitry

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1996 A fully operational 8×8 array of GaAs resonant cavity-enhanced light emitting diodes (RCELED) was directly integrated on top of a silicon grayscale driver circuit. The integrated optoelectronic circuit allowed 32-level grayscale emission from each individu ... Cite

Integrated 155 Mbps digital transmitter using a 1.3 μm wavelength thin film LED

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1996 A digital transmitter was developed by bonding Indium phosphide based thin film surface emitters directly to digital silicon complementary metal oxide semiconductor (CMOS) circuits operating at 155 Mbps with digital I/O for application in a three dimension ... Cite

A single-fiber bidirectional optical link using colocated emitters and detectors

Journal article IEEE Photonics Technology Letters · October 1, 1996 This letter reports the bonding of a small, thin-film GaAs-based emitter onto a larger silicon detector to realize spatial colocation of the emitter and detector. These colocated devices enable single fiber bidirectional communication between the two analo ... Full text Cite

Thin-film multimaterial optoelectronic integrated circuits

Journal article IEEE Transactions on Components Packaging and Manufacturing Technology Part B · February 1, 1996 The multimaterial integration of thin-film optoelectronic devices with host substrates ranging from silicon circuits to glass waveguides to polymer micromachines offers to the system designer the freedom to choose the optimal materials for each component t ... Full text Cite

Integrated 200 Mbit/s receiver: silicon CMOS transimpedance amplifier with a thin-film InGaAs photodetector

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · January 1, 1996 Digital CMOS can be used for analog receiver designs if the packaging parasitics can be sufficiently reduced. Using direct bonding of a thin-film detector to a CMOS circuit, high-performance receivers can be realized in low-cost, standard foundry CMOS. Thi ... Cite

Smart pixel bi-directional optical link using co-located emitters and detectors

Journal article LEOS Summer Topical Meeting · January 1, 1996 A single fiber bi-directional smart pixel link is proposed which uses the colocation of an emitter and detector at each end of the fiber. To realize a fully functional communications link, CMOS analog optoelectronic receiver and transmitter circuits which ... Cite

CMOS optical receiver with integrated InGaAs thin-film inverted MSM detector operating up to 250 Mbps

Journal article LEOS Summer Topical Meeting · January 1, 1996 A quasi-monolithic digital CMOS amplifier has been integrated with 1.3 μm wavelength, InGaAs I-MSM. The power dissipation is less than 20 mW. The sensitivity for 10-10 BER measured at 27-1, 155 Mbps PRBS is about 8 μA. This integratio ... Cite

155 Mbps digital transmitter using GaAs thin film LEDs bonded to silicon driver circuits

Journal article LEOS Summer Topical Meeting · January 1, 1996 A low cost, low power digital silicon transmitter integrated with a GaAs-based RCELED has been fabricated and characterized. Operation at 155 Mbps has been demonstrated with a digital input, resulting in a transmitter which is integrable with digital Si ci ... Cite

Smart detectors: devices, integration, circuits, and systems

Journal article Proceedings of SPIE the International Society for Optical Engineering · December 1, 1995 The fabrication and performance of thin film p-i-n and metal-semiconductor-metal (MSM) photodetectors and the integration of these detectors onto silicon circuitry is presented. The thin film photodetectors are separated from the growth substrate using epi ... Cite

Fast on-line neural network training algorithm for a rectifier regulator

Journal article IECON Proceedings Industrial Electronics Conference · December 1, 1995 This paper addresses the problem of deadbeat control in fully controlled high power factor rectifiers. Improved deadbeat control can be achieved through the use of neural network-based predictors for the input current reference to the rectifier. In this ap ... Cite

Identification and control of induction motor stator currents using fast on-line random training of a neural network

Journal article Conference Record IAS Annual Meeting IEEE Industry Applications Society · December 1, 1995 Artificial Neural Networks (ANNs) which have no off-line pre-training, can be trained continually on-line to identify an inverter fed induction motor and control its stator currents. Due to the small time constants of the motor circuits, the time to comple ... Cite

CMOS optical receiver with integrated compound semiconductor thin-film inverted MSM detector operating at 155 Mbps

Journal article Conference Proceedings Lasers and Electro Optics Society Annual Meeting LEOS · December 1, 1995 Low cost silicon digital CMOS foundry circuitry is a prime candidate for low cost, high performance optoelectronic receivers. However, silicon detectors are not as efficient as compound semiconductor detectors. Hybrid packaging of compound semiconductor de ... Cite

Design issues for through-wafer optoelectronic multicomputer interconnects

Journal article International Conference on Massively Parallel Processing Using Optical Interconnections MPPOI Proceedings · December 1, 1995 This paper presents several design issues associated with the implementation of a three dimensional optically interconnected parallel processing system. A technique for improving bit error rate in low power multistage networks is presented. Error detection ... Cite

Manufacturable multi-material integration: Compound semiconductor devices bonded to silicon circuitry

Journal article Proceedings of SPIE the International Society for Optical Engineering · September 15, 1995 The integration of thin film optoelectronic devices with host substrates such as circuits, waveguides, and micromachines offers to the systems engineer the freedom to choose the optimal materials to achieve performance and cost objectives. In essence, the ... Full text Cite

Nonlinearity Correction Techniques for High Speed, High Resolution A/D Conversion

Journal article IEEE Transactions on Circuits and Systems II Analog and Digital Signal Processing · January 1, 1995 In general, low resolution circuitry can be designed with higher speed performance than high resolution circuitry. Most high resolution A/D converter architectures require a high resolution component, such as a S/H or integrator, in their design and are of ... Full text Cite

A Three-Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect

Journal article Journal of Lightwave Technology · January 1, 1995 This paper presents a three-dimensional, highly parallel, optically interconnected system to process high-throughput stream data such as images. The vertical optical interconnections are realized using integrated optoelectronic devices operating at wavelen ... Full text Cite

Three-dimensional, massively parallel, optically interconnected silicon computational hardware and architectures for high-speed IR scene generation

Journal article Proceedings of SPIE the International Society for Optical Engineering · January 1, 1995 High frame rate infrared scene generation depends on high performance digital processors that are tightly coupled to infrared emitter arrays. Massively parallel image generation hardware can realize the type of high throughput, high frame rate processing t ... Cite

8 x 8 Array of Thin-Film Photodetectors Vertically Electrically Interconnected to Silicon Circuitry

Journal article IEEE Photonics Technology Letters · January 1, 1995 This paper reports the integration of an 8 x 8 array of thin-film GaAs-AlGaAs photodetectors onto a silicon-oscillator array circuit for massively parallel-image processing applications. Each detector was electrically connected to the oscillator below it u ... Full text Cite

Communication through Stacked Silicon Circuitry Using Integrated thin Film InP-Based Emitters and Detectors

Journal article IEEE Photonics Technology Letters · January 1, 1995 To demonstrate optical communication through stacked silicon circuitry, thin film InGaAsP-based emitters and photodetectors have been bonded directly onto silicon circuitry. These optoelectronic devices operate at a wavelength to which silicon is transpare ... Full text Cite

Silicon CMOS optical receiver circuits with integrated thin-film compound semiconductor detectors

Journal article Proceedings of SPIE the International Society for Optical Engineering · January 1, 1995 While many circuit designers have tackled the problem of CMOS digital communications receiver design, few have considered the problem of circuitry suitable for an all CMOS digital IC fabrication process. Faced with a high speed receiver design the circuit ... Cite

Design, fabrication, and test of a 125Mb/s transimpedance amplifier using MOSIS 1.2μm standard digital CMOS process

Journal article Midwest Symposium on Circuits and Systems · December 1, 1994 A front-end transimpedance amplifier for an optical receiver is designed, fabricated through MOSIS 1.2μm digital CMOS foundry, and tested. The amplifier meets the specification of FDDI physical layer. Test shows that the bandwidth of the circuit is more th ... Cite

Compact, precise digital to analog converter arrays in a low cost, low precision short channel CMOS process

Journal article Midwest Symposium on Circuits and Systems · December 1, 1994 A useful circuit topology for the realization of compact, precise digital to analog converters is presented. The converter architecture uses digital correction to obtain good precision in an inexpensive, non-precision, short channel, digital CMOS process. ... Cite

High density focal plane signal processing using 3-D vertical interconnects

Journal article Midwest Symposium on Circuits and Systems · December 1, 1994 A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity ... Cite

Three dimensional smart pixel integration of a GaAs-based detector array directly on top of silicon circuits

Journal article LEOS Summer Topical Meeting · December 1, 1994 A smart pixel imaging array of GaAs-based thin film photodetectors has been integrated in three dimensions directly on top of silicon neuromorphic oscillator circuits. Photomicrographs of the integrated assembly and test results are presented. ... Cite

Silicon CMOS optical receiver circuit with integrated compound semiconductor thin-film P-i-N detector

Journal article LEOS Summer Topical Meeting · December 1, 1994 Low cost, high complexity silicon CMOS circuitry is an ideal candidate for low cost, high performance integrated optoelectronics. The paper presents a study on the integration of GaAs and InP based thin film P-i-N detectors with a five stage silicon CMOS t ... Cite

Fast solution of nonlinear equations using parallel analog hardware

Journal article Analog Integrated Circuits and Signal Processing · September 1, 1994 Parallel analog circuits are introduced for the solution of systems of nonlinear algebraic equations and the integration of systems of differential equations. Both simulations using HSPICE and a hardware implementation are presented which show how the circ ... Full text Cite

Low Control Voltage Programming of Floating Gate MOSFETs and Applications

Journal article IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · January 1, 1994 Programming of EEPROM devices fabricated in standard processes often requires voltages that exceed the bulk-drain breakdown voltages of integrated circuits, making the full integration of the programming circuitry difficult. This paper presents a modified ... Full text Cite

A floating gate CMOS signal conditioning circuit for nonlinearity correction

Journal article Analog Integrated Circuits and Signal Processing · July 1, 1993 A high-speed signal conditioning circuit is presented that can be programmed for correction of nonlinearity in a sensor signal processing system. The function of the circuit is based on piecewise linear principles. Post-fabrication programming to adapt to ... Full text Cite

Symbolic substitution system for data compression.

Journal article Applied optics · February 1993 A new application of symbolic substitution is presented for string matching with the goal of data compression. A temporal sequence of input symbols is mapped onto a two-dimensional array that contains a tree structure, which in turn is mapped into another ... Full text Cite

A Programmable Piecewise Linear Large-Signal CMOS Amplifier

Journal article IEEE Journal of Solid State Circuits · January 1, 1993 A high-speed CMOS piecewise linear approximation circuit is presented that can be programmed for correction of nonlinearity after fabrication. The basic building block generates a linear segment, for which slope and position can be adjusted. Adjustments to ... Full text Cite

Analog neural network chip with random weight change learning algorithm

Journal article Proceedings of the International Joint Conference on Neural Networks · January 1, 1993 Although researchers have been engaged in fabrication of neural network hardware, only a few networks implemented with a learning algorithm have been reported. A learning algorithm is required to be implemented on a VLSI chip because off-chip learning with ... Cite

High resolution nonlinearity correcting A/D converter architecture

Journal article Proceedings IEEE International Symposium on Circuits and Systems · January 1, 1993 An architecture is presented for a high resolution analog-to-digital (A/D) converter with tolerance to nonlinearities in the critical timing path as well as offsets and gain errors. An error budget analysis is also included which describes the relationship ... Cite

Vertical Electrical Interconnection of Compound Semiconductor Thin-Film Devices to Underlying Silicon Circuitry

Journal article IEEE Photonics Technology Letters · January 1, 1992 A three-dimensional integration technology that electrically connects an independently optimized thin-film device layer to a Si circuitry layer is reported in this paper. An epitaxial liftoff GaAs thin-film optical detector is integrated directly on top of ... Full text Cite

Temporal pattern identification in a self-organizing neural network with an application to data compression

Journal article Proceedings Ijcnn International Joint Conference on Neural Networks · January 1, 1992 Summary form only given. A neural network system is considered that seeks to find the optimal structure embedded in a temporal sequence. This structure is manifested by the existence of a finite number of subsequences that comprise the temporal sequence. T ... Cite

A floating-gate MOSFET with tunneling injector fabricated using a standard double-polysilicon CMOS process

Journal article Electron Device Letters · January 1, 1991 A floating-gate MOSFET which is programmable in both directions by Fowler-Nordheim tunneling and is fabricated using an inexpensive standard 2-μm double-polysilicon CMOS technology is discussed. Tunneling occurs at a crossover of polysilicon 1 with polysil ... Full text Cite

A Parasitics Extraction and Network Reduction Algorithm for Analog VLSI

Journal article IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems · January 1, 1991 This paper discusses an algorithm for the extraction of circuit parasitics in integrated circuits using classical transmission line models. This gives a better account of the dc and ac characteristics of interconnects than models incorporating exclusively ... Full text Cite

Obtaining high precision operation from nonideal neural networks

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 1990 Several potential neural architectures for an A/D converter are examined, and the level of nonidealities that can be tolerated by the network components without inhibiting high-precision operation through training is discussed. Behavioral-level simulations ... Cite

A new structure for an analog divider

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 1990 A structure for an analog divider that allows the use of short-channel devices for high speed without loss in accuracy due to second-order effects is proposed. It consists of 13 parallel modules that each approximate a division in a small region. The weigh ... Cite

A neural network approach to high performance analog circuit design

Journal article Midwest Symposium on Circuits and Systems · December 1, 1990 In order to gain new insight into the design of high-precision, high-speed analog circuits, several possible network implementations of an A/D converter are presented. These networks are marked by programmability and parallelism, which can be used to maint ... Cite

A parasitics extraction and network reduction algorithm for VLSI

Journal article Midwest Symposium on Circuits and Systems · December 1, 1990 An algorithm for the extraction of circuit parasitics in integrated circuits using classic transmission line models is discussed. This gives a better account of the DC and AC characteristics of interconnects than models incorporating exclusively either the ... Cite

A 1 MHz compact digitally controlled perceptron integrated circuit implementation with process insensitivity

Journal article Proceedings IEEE International Symposium on Circuits and Systems · December 1, 1990 A fast, compact process and temperature insensitive perceptron neural network is introduced. The integrated circuit proposed forms one layer in a perceptron neural network that can be easily cascaded to form a multiple-layer network. The implementation rea ... Cite

BITPAR: PROCESS-DERIVED BIPOLAR TRANSISTOR PARAMETERIZATION.

Journal article IEEE Journal of Solid State Circuits · January 1, 1986 A detailed technical description is given of BITPAR, a VAX-compatible Fortran program that computes SPICE Gummel-Poon parameters for a macromodel of an integrated bipolar-junction transistor (IBJT). The program permits formulation of implicit relationships ... Full text Cite

BITPAR: PROCESS-DERIVED BIPOLAR TRANSISTOR PARAMETERIZATION.

Journal article IEEE Journal of Solid-State Circuits · 1986 A detailed technical description is given of BITPAR, a VAX-compatible Fortran program that computes SPICE Gummel-Poon parameters for a macromodel of an integrated bipolar-junction transistor (IBJT). The program permits formulation of implicit relationships ... Cite