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Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I

Publication ,  Journal Article
Hao, Q; Chen, KN; Goel, SK; Li, H; Marinissen, EJ
Published in: IEEE Journal on Emerging and Selected Topics in Circuits and Systems
January 1, 2025
Published version (DOI)

Duke Scholars

Hai "Helen" Li
Author Hai "Helen" Li Pierre R. Lamond Department of Electrical and Computer Engin ...

Published In

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

DOI

10.1109/JETCAS.2025.3600772

EISSN

2156-3365

ISSN

2156-3357

Publication Date

January 1, 2025

Volume

15

Issue

3

Start / End Page

362 / 367

Related Subject Headings

  • 4008 Electrical engineering
 

Citation

APA
Chicago
ICMJE
MLA
NLM
Hao, Q., Chen, K. N., Goel, S. K., Li, H., & Marinissen, E. J. (2025). Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I. IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 15(3), 362–367. https://doi.org/10.1109/JETCAS.2025.3600772
Hao, Q., K. N. Chen, S. K. Goel, H. Li, and E. J. Marinissen. “Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I.” IEEE Journal on Emerging and Selected Topics in Circuits and Systems 15, no. 3 (January 1, 2025): 362–67. https://doi.org/10.1109/JETCAS.2025.3600772.
Hao Q, Chen KN, Goel SK, Li H, Marinissen EJ. Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I. IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 2025 Jan 1;15(3):362–7.
Hao, Q., et al. “Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I.” IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 3, Jan. 2025, pp. 362–67. Scopus, doi:10.1109/JETCAS.2025.3600772.
Hao Q, Chen KN, Goel SK, Li H, Marinissen EJ. Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I. IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 2025 Jan 1;15(3):362–367.

Published In

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

DOI

10.1109/JETCAS.2025.3600772

EISSN

2156-3365

ISSN

2156-3357

Publication Date

January 1, 2025

Volume

15

Issue

3

Start / End Page

362 / 367

Related Subject Headings

  • 4008 Electrical engineering